Microchip Technology M2S005-1TQG144I

Zu Produktinformationen springen
1 von 1
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Normaler Preis Dhs. 76.76
Normaler Preis Dhs. 80.80 Verkaufspreis Dhs. 76.76
Sale Ausverkauft
Quantity Unit Price Total Price
1 Dhs. 76.76 Dhs. 76.76
15+ Dhs. 74.34 Dhs. 1,115.10
25+ Dhs. 72.72 Dhs. 1,818.00
50+ Dhs. 68.68 Dhs. 3,434.00
100+ Dhs. 60.60 Dhs. 6,060.00
N+ Dhs. 12.12 Price Inquiry
Versand wird beim Checkout berechnet
Anzahl
Component Recycling

Request Quote / Inquiry

Microchip M2S005-1TQG144I SmartFusion®2 System-on-Chip

The M2S005-1TQG144I from Microchip Technology combines the flexibility of an FPGA with the processing power of an ARM® Cortex®-M3 microcontroller in a single, integrated SmartFusion®2 device. Engineered for embedded applications requiring both programmable logic and real-time processing, this SoC delivers exceptional performance at 166MHz with comprehensive connectivity options.

Key Features & Benefits

  • Dual Architecture: ARM® Cortex®-M3 MCU core integrated with 5K FPGA logic modules for maximum design flexibility
  • High Performance: 166MHz operating speed with 128KB Flash and 64KB RAM for demanding applications
  • Rich Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, and USB interfaces for versatile system integration
  • Industrial Grade: -40°C to 100°C (TJ) operating temperature range for harsh environments
  • Compact Package: 144-TQFP (20x20mm) footprint optimized for space-constrained designs
  • RoHS Compliant: Meets environmental standards for global distribution

Ideal Applications

Perfect for aerospace, automotive, industrial automation, medical devices, and telecommunications systems requiring secure, low-power processing with programmable logic capabilities. The SmartFusion®2 architecture enables design-in flexibility for motor control, sensor fusion, protocol bridging, and edge computing applications.

Authorized Distributor: Full traceability, RoHS/REACH compliance documentation, and technical support available. Bulk tray packaging for production-scale requirements.

Product attributes Property Value
Manufacturer Microchip Technology
Product Series SmartFusion®2
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor ARM® Cortex®-M3
Flash Size 128KB
RAM Size 64KB
Peripherals -
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Speed 166MHz
Primary Attributes FPGA - 5K Logic Modules
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 144-LQFP
Supplier Device Package 144-TQFP (20x20)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.