Microchip Technology M2S060-FG676
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 463.05 | Dhs. 463.05 |
| 15+ | Dhs. 448.44 | Dhs. 6,726.60 |
| 25+ | Dhs. 438.70 | Dhs. 10,967.50 |
| 50+ | Dhs. 414.32 | Dhs. 20,716.00 |
| 100+ | Dhs. 365.58 | Dhs. 36,558.00 |
| N+ | Dhs. 73.12 | Price Inquiry |
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M2S060-FG676 SmartFusion®2 FPGA System-on-Chip
The M2S060-FG676 from Microchip Technology combines the flexibility of FPGA logic with the deterministic processing of an ARM® Cortex®-M3 microcontroller in a single, power-efficient device. Featuring 60K logic modules, 256KB Flash, and 64KB RAM, this SmartFusion®2 SoC delivers exceptional performance for embedded applications requiring both programmable logic and real-time processing.
Key Features & Benefits
- Dual Architecture: FPGA fabric + ARM Cortex-M3 MCU for maximum design flexibility
- High-Speed Connectivity: Integrated DDR, PCIe, and SERDES interfaces
- Rich Peripheral Set: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Industrial Temperature Range: 0°C to 85°C (TJ) for reliable operation
- 676-FBGA Package: Compact 27x27mm footprint for space-constrained designs
- Active Part Status: Long lifecycle availability with full traceability and RoHS/REACH compliance
Ideal Applications
Perfect for aerospace avionics, automotive ADAS systems, industrial automation controllers, medical imaging equipment, and telecom infrastructure requiring deterministic control with FPGA acceleration.
Design Support: Datasheets, reference designs, and technical resources available. Contact our engineering team for design-in assistance and volume pricing.
| Product attributes | Property Value |
| Manufacturer | Microchip Technology |
| Product Series | SmartFusion®2 |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | ARM® Cortex®-M3 |
| Flash Size | 256KB |
| RAM Size | 64KB |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Speed | 166MHz |
| Primary Attributes | FPGA - 60K Logic Modules |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 676-BGA |
| Supplier Device Package | 676-FBGA (27x27) |
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
