Microchip Technology M2S060T-1FGG676I

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The M2S060T-1FGG676I is a high-performance SmartFusion2 System-on-Chip (SoC) FPGA from Microchip Technology, combining an ARM Cortex-M3 microcontroller with 60,000 logic modules in a single device. This industrial-grade programmable logic device features 256KB Flash memory, 64KB RAM, and advanced connectivity options including DDR, PCIe, SERDES, Ethernet, USB, and CAN bus interfaces.

Designed for demanding applications in industrial automation, automotive systems, aerospace, and communications infrastructure, this SoC FPGA operates reliably across the extended temperature range of -40°C to 100°C. The 676-FBGA package (27x27mm) provides excellent I/O density while maintaining thermal performance.

Key Features & Benefits:

  • ARM Cortex-M3 processor core running at 166MHz for embedded processing
  • 60K logic modules for complex FPGA designs and custom logic implementation
  • 256KB embedded Flash + 64KB SRAM for program and data storage
  • High-speed interfaces: DDR memory controller, PCIe, SERDES for demanding data throughput
  • Multiple connectivity options: Ethernet MAC, USB 2.0, CAN bus, I2C, SPI, UART for versatile system integration
  • Industrial temperature range: -40°C to 100°C (TJ) for harsh environment operation
  • RoHS compliant for environmental compliance
  • 676-FBGA package (27x27mm) for high I/O density and compact design

Target Applications:

This SmartFusion2 SoC FPGA is ideal for:

  • Motor control and industrial drives
  • Industrial networking and fieldbus gateways
  • Embedded vision systems and image processing
  • Secure communications and encryption
  • Automotive infotainment and ADAS
  • Aerospace instrumentation and avionics
  • Medical devices and diagnostic equipment
  • Test and measurement instruments

Why Choose M2S060T-1FGG676I?

The SmartFusion2 family combines the flexibility of FPGA logic with the deterministic performance of an ARM Cortex-M3 microcontroller, enabling you to implement custom peripherals, accelerate time-critical functions, and reduce system complexity. With built-in security features and comprehensive development tools, this SoC FPGA accelerates your time-to-market while ensuring long-term product availability.

Technical Specifications:

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Product attributes Property Value
Manufacturer Microchip Technology
Product Series SmartFusion®2
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor ARM® Cortex®-M3
Flash Size 256KB
RAM Size 64KB
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Speed 166MHz
Primary Attributes FPGA - 60K Logic Modules
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.