Microsemi Corporation M2S090-1FG676IX417

Zu Produktinformationen springen
1 von 1
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Normaler Preis Dhs. 750.29
Normaler Preis Dhs. 789.77 Verkaufspreis Dhs. 750.29
Sale Ausverkauft
Quantity Unit Price Total Price
1 Dhs. 750.29 Dhs. 750.29
15+ Dhs. 726.59 Dhs. 10,898.85
25+ Dhs. 710.79 Dhs. 17,769.75
50+ Dhs. 671.30 Dhs. 33,565.00
100+ Dhs. 592.33 Dhs. 59,233.00
N+ Dhs. 118.47 Price Inquiry
Versand wird beim Checkout berechnet
Anzahl
Component Recycling

Request Quote / Inquiry

Microsemi SmartFusion2 M2S090-1FG676IX417 SoC FPGA

The M2S090-1FG676IX417 is a high-performance System-on-Chip (SoC) FPGA from Microsemi's SmartFusion®2 family, combining an ARM® Cortex®-M3 processor with 90,000 logic modules for demanding aerospace, automotive, industrial automation, and telecom infrastructure applications.

Key Features

  • Dual Architecture: ARM Cortex-M3 MCU + 90K logic module FPGA for flexible system design
  • High-Speed Processing: 166MHz operation with 512KB Flash and 64KB RAM
  • Advanced Connectivity: DDR, PCIe, SERDES, CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Industrial Temperature Range: -40°C to 100°C (TJ) for harsh environments
  • Compact 676-FBGA Package: 27x27mm footprint for space-constrained designs

Ideal Applications

This SoC FPGA excels in applications requiring programmable logic, embedded processing, and robust peripheral integration—perfect for motor control, industrial networking, secure communications, and real-time data acquisition systems.

Note: This component is marked as obsolete. Please verify availability and consider lifecycle planning for long-term projects.

Product attributes Property Value
Manufacturer Microsemi Corporation
Product Series SmartFusion®2
Packaging Bag |
Part Status Obsolete
Architecture MCU, FPGA
Core Processor ARM® Cortex®-M3
Flash Size 512KB
RAM Size 64KB
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Speed 166MHz
Primary Attributes FPGA - 90K Logic Modules
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)