Microchip Technology M2S090-FGG676
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 823.03 | Dhs. 823.03 |
| 15+ | Dhs. 797.03 | Dhs. 11,955.45 |
| 25+ | Dhs. 779.71 | Dhs. 19,492.75 |
| 50+ | Dhs. 736.39 | Dhs. 36,819.50 |
| 100+ | Dhs. 649.76 | Dhs. 64,976.00 |
| N+ | Dhs. 129.95 | Price Inquiry |
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M2S090-FGG676 SmartFusion2 SoC FPGA Overview
The M2S090-FGG676 from Microchip Technology is a high-performance SmartFusion®2 System-on-Chip (SoC) FPGA combining an ARM® Cortex®-M3 microcontroller with 90,000 logic modules. Operating at 166MHz with 512KB Flash and 64KB RAM, this device delivers robust processing power for industrial, automotive, aerospace, and communications applications.
Featuring advanced connectivity options including CANbus, Ethernet, I²C, SPI, UART/USART, and USB, plus high-speed peripherals (DDR, PCIe, SERDES), the M2S090-FGG676 provides flexible integration for complex embedded systems. The 676-FBGA (27x27mm) package operates across 0°C to 85°C and is RoHS compliant, ensuring long-term availability and regulatory adherence.
Key Features & Benefits
- Dual Architecture: ARM Cortex-M3 MCU + 90K logic FPGA for programmable hardware acceleration
- High-Speed Connectivity: DDR, PCIe, SERDES for data-intensive applications
- Rich Peripheral Set: CANbus, Ethernet, USB, I²C, SPI, UART/USART
- Generous Memory: 512KB Flash, 64KB RAM for firmware and data storage
- Industrial Temperature Range: 0°C to 85°C (TJ) for reliable operation
- Compact BGA Package: 676-FBGA (27x27mm) for space-constrained designs
- Active & RoHS Compliant: Long-term supply assurance and environmental compliance
Applications
- Industrial automation and control systems
- Automotive electronics and ADAS
- Aerospace and defense embedded systems
- Communications infrastructure and networking equipment
- Medical devices and instrumentation
- High-reliability embedded computing
All specifications are subject to manufacturer documentation. Please consult official datasheets for complete design guidelines and electrical characteristics.
| Product attributes | Property Value |
| Manufacturer | Microchip Technology |
| Product Series | SmartFusion®2 |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | ARM® Cortex®-M3 |
| Flash Size | 512KB |
| RAM Size | 64KB |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Speed | 166MHz |
| Primary Attributes | FPGA - 90K Logic Modules |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 676-BGA |
| Supplier Device Package | 676-FBGA (27x27) |
| ROHS |  |
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
