Microchip Technology M2S090TS-FGG676

Zu Produktinformationen springen
1 von 1
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Normaler Preis Dhs. 1,111.15
Normaler Preis Dhs. 1,169.63 Verkaufspreis Dhs. 1,111.15
Sale Ausverkauft
Quantity Unit Price Total Price
1 Dhs. 1,111.15 Dhs. 1,111.15
15+ Dhs. 1,076.06 Dhs. 16,140.90
25+ Dhs. 1,052.67 Dhs. 26,316.75
50+ Dhs. 994.19 Dhs. 49,709.50
100+ Dhs. 877.22 Dhs. 87,722.00
N+ Dhs. 175.44 Price Inquiry
Versand wird beim Checkout berechnet
Anzahl
Component Recycling

Request Quote / Inquiry

Microchip M2S090TS-FGG676 SmartFusion2 SoC FPGA

The M2S090TS-FGG676 is a high-performance System-on-Chip (SoC) FPGA from Microchip Technology's SmartFusion®2 family, combining an ARM® Cortex®-M3 microcontroller with 90,000 logic modules of FPGA fabric. This powerful integration delivers exceptional flexibility for mission-critical applications in aerospace, automotive, industrial, medical, and telecommunications sectors.

Key Features & Benefits

  • Dual Architecture: ARM Cortex-M3 MCU + 90K logic module FPGA for maximum design flexibility
  • High-Speed Processing: 166MHz core frequency with 512KB Flash and 64KB RAM
  • Advanced Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB interfaces
  • High-Performance Peripherals: DDR, PCIe, and SERDES support for demanding applications
  • Industrial Temperature Range: 0°C to 85°C (TJ) for reliable operation in harsh environments
  • Compact 676-FBGA Package: 27x27mm footprint for space-constrained designs
  • RoHS Compliant: Meets environmental standards for global deployment

Ideal Applications

Perfect for embedded systems requiring programmable logic combined with microcontroller functionality, including industrial automation, motor control, communications infrastructure, medical devices, and aerospace/defense systems requiring long lifecycle support and full traceability.

Product attributes Property Value
Manufacturer Microchip Technology
Product Series SmartFusion®2
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor ARM® Cortex®-M3
Flash Size 512KB
RAM Size 64KB
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Speed 166MHz
Primary Attributes FPGA - 90K Logic Modules
Operating Temperature 0°C ~ 85°C (TJ)
Grade -
Qualification -
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.