Microchip Technology M2S150TS-WAFERLOT

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Normaler Preis Dhs. 355,842.93
Normaler Preis Dhs. 374,571.50 Verkaufspreis Dhs. 355,842.93
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1 Dhs. 355,842.93 Dhs. 355,842.93
15+ Dhs. 344,605.78 Dhs. 5,169,086.70
25+ Dhs. 337,114.35 Dhs. 8,427,858.75
50+ Dhs. 318,385.78 Dhs. 15,919,289.00
100+ Dhs. 280,928.63 Dhs. 28,092,863.00
N+ Dhs. 56,185.73 Price Inquiry
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Microchip SmartFusion2 M2S150TS-WAFERLOT SoC FPGA

The M2S150TS-WAFERLOT is a high-performance System-on-Chip (SoC) FPGA from Microchip Technology's SmartFusion®2 family, combining an ARM® Cortex®-M3 microcontroller core with 150,000 logic modules of FPGA fabric. This wafer lot offering is ideal for volume production of industrial, automotive, aerospace, communications, and edge computing applications requiring deterministic, low-power processing with flexible hardware acceleration.

Key Features & Benefits

  • Dual-Architecture Processing: ARM Cortex-M3 MCU core running at 166MHz paired with 150K logic module FPGA fabric for hardware/software co-design flexibility
  • Generous On-Chip Memory: 512KB Flash and 64KB RAM for application code and data storage
  • High-Speed Connectivity: Integrated DDR controller, PCIe, and SERDES for demanding data throughput requirements
  • Rich Peripheral Set: CANbus, Ethernet, I²C, SPI, UART/USART, and USB interfaces for versatile system integration
  • Wafer Lot Format: Bulk wafer packaging for cost-effective volume manufacturing and custom die integration

Ideal Applications

This SoC FPGA is engineered for mission-critical systems in industrial automation, motor control, communications infrastructure, avionics, automotive ADAS, and edge AI/ML inference where deterministic real-time performance, security, and power efficiency are paramount.

Note: This is a wafer lot product intended for volume manufacturing. Contact us for lead times, MOQ, and custom packaging options.

Product attributes Property Value
Manufacturer Microchip Technology
Product Series SmartFusion®2
Packaging | Bulk
Architecture MCU, FPGA
Core Processor ARM® Cortex®-M3
Flash Size 512KB
RAM Size 64KB
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Speed 166MHz
Primary Attributes FPGA - 150K Logic Modules
Operating Temperature -
Grade -
Qualification -
Package / Case Die
Supplier Device Package Wafer

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.