Microsemi Corporation M7AFS600-PQG208I

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Normaler Preis Dhs. 355,874.90
Normaler Preis Dhs. 374,605.16 Verkaufspreis Dhs. 355,874.90
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15+ Dhs. 344,636.75 Dhs. 5,169,551.25
25+ Dhs. 337,144.64 Dhs. 8,428,616.00
50+ Dhs. 318,414.39 Dhs. 15,920,719.50
100+ Dhs. 280,953.87 Dhs. 28,095,387.00
N+ Dhs. 56,190.77 Price Inquiry
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Microsemi M7AFS600-PQG208I Fusion® FPGA - Industrial Grade

The M7AFS600-PQG208I is a high-performance FPGA from Microsemi's Fusion® family, designed for demanding industrial, automotive, and aerospace applications requiring long-term availability and proven reliability.

Key Features:

  • 600,000 Gates - Substantial logic capacity for complex embedded designs
  • 95 I/O Pins - Flexible connectivity in a compact 208-PQFP footprint
  • 110,592 RAM Bits - Integrated memory for data buffering and processing
  • Industrial Temperature Range - Operates reliably from -40°C to 85°C (TA)
  • Surface Mount Package - 208-PQFP (28x28mm) for automated assembly
  • 1.425V ~ 1.575V Supply - Low-power operation with tight voltage tolerance

Applications:

Ideal for industrial control systems, medical devices, telecommunications infrastructure, automotive electronics, and aerospace systems where long lifecycle support and RoHS/REACH compliance are critical.

Why Choose This Component:

  • ✓ Authorized distributor with full manufacturer traceability
  • ✓ RoHS and REACH compliant
  • ✓ Long lifecycle commitment for design-in confidence
  • ✓ Original factory packaging (Tray)
  • ✓ Technical support and documentation available

Product attributes Property Value
Manufacturer Microsemi Corporation
Product Series Fusion®
Packaging | Tray
Number of LABs/CLBs -
Number of Logic Elements/Cells -
Total RAM Bits 110592
Number of I/O 95
Number of Gates 600000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 85°C (TA)
Grade -
Qualification -
Package / Case 208-BFQFP
Supplier Device Package 208-PQFP (28x28)

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.