NXP USA Inc. MPC870CVR66
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The MPC870CVR66 is a high-performance PowerPC microprocessor from NXP USA Inc., engineered for mission-critical embedded applications across aerospace, automotive, industrial, and telecommunications sectors. Operating at 66MHz with a 32-bit architecture, this processor delivers reliable performance in extreme environments ranging from -40°C to 100°C.
Key Features:
- Core Architecture: Single-core MPC8xx PowerPC processor with Communications Processor Module (CPM)
- Connectivity: Dual 10/100Mbps Ethernet ports, USB 2.0, I2C, SPI, UART, TDM, PCMCIA
- Memory Support: DRAM controller for flexible memory configurations
- Industrial-Grade: Surface mount 256-BBGA package (23x23mm) with 3.3V I/O
- Extended Temperature Range: -40°C to 100°C operation for harsh environments
- RoHS Compliant: Environmentally friendly manufacturing
Applications:
Perfect for embedded control systems, network appliances, industrial automation, telecommunications equipment, and automotive ECUs requiring robust, long-term reliability.
Technical Specifications:
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| Product attributes | Property Value |
| Manufacturer | NXP USA Inc. |
| Product Series | MPC8xx |
| Packaging | | |
| Core Processor | MPC8xx |
| Number of Cores/Bus Width | 1 Core, 32-Bit |
| Speed | 66MHz |
| Co-Processors/DSP | Communications; CPM |
| RAM Controllers | DRAM |
| Graphics Acceleration | No |
| Display & Interface Controllers | - |
| Ethernet | 10/100Mbps (2) |
| SATA | - |
| USB | USB 2.0 (1) |
| Voltage - I/O | 3.3V |
| Operating Temperature | -40°C ~ 100°C (TA) |
| Grade | - |
| Qualification | - |
| Security Features | - |
| Mounting Type | Surface Mount |
| Package / Case | 256-BBGA |
| Supplier Device Package | 256-PBGA (23x23) |
| Additional Interfaces | I2C, PCMCIA, SPI, TDM, UART |
| ROHS |  |
MPC870CVR66.pdf
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