Macronix MX63U1GC12HAXMI01

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Normaler Preis Dhs. 16.44
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Macronix MX63U1GC12HAXMI01 - 1Gbit Multi-Chip Package (MCP) Memory Solution

The Macronix MX63U1GC12HAXMI01 is a high-performance, high-reliability multi-chip package (MCP) combining 1Gbit SLC NAND Flash memory with LPDDR2 DRAM in a compact 162-ball BGA package. Engineered for demanding applications in industrial, automotive, telecommunications, and aerospace sectors, this memory solution delivers exceptional endurance and data integrity across extended temperature ranges.

Key Features & Benefits:

  • Dual Memory Technology: Combines SLC NAND Flash (non-volatile) with LPDDR2 RAM (volatile) for optimized performance
  • 1Gbit Capacity: 128M x 8 organization provides ample storage for embedded systems
  • ONFI Interface: Industry-standard interface ensures broad compatibility
  • Wide Operating Temperature: -40°C to 85°C (TA) for harsh environment reliability
  • Compact Form Factor: 162-BGA (8x10.5mm) surface mount package saves board space
  • Low Voltage Operation: 1.7V ~ 1.95V supply voltage for power-efficient designs
  • Long Lifecycle Support: Backed by Macronix's commitment to product longevity

Ideal Applications:

Perfect for automotive ECUs, industrial controllers, medical devices, telecommunications equipment, and aerospace systems requiring reliable, long-term memory solutions with full traceability.

All specifications are subject to change. Please refer to the manufacturer's datasheet for the most current information.

Product attributes Property Value
Manufacturer Macronix
Product Series MX63U
Packaging Tray | Tray
Memory Type Non-Volatile, Volatile
Memory Format FLASH, RAM
Technology FLASH - NAND (SLC), DRAM - LPDDR2
Memory Size 1Gbit
Memory Organization 128M x 8
Memory Interface ONFI
Clock Frequency -
Write Cycle Time - Word, Page -
Access Time -
Voltage - Supply 1.7V ~ 1.95V
Operating Temperature -40°C ~ 85°C (TA)
Grade -
Qualification -
Mounting Type Surface Mount
Package / Case 162-VFBGA
Supplier Device Package 162-BGA (8x10.5)