Texas Instruments OMAPL137AZKB3

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Texas Instruments OMAPL137AZKB3 - High-Performance ARM + DSP Microprocessor

The OMAPL137AZKB3 from Texas Instruments represents a powerful dual-core solution combining an ARM926EJ-S processor with a C674x DSP core, delivering exceptional performance for industrial automation, medical devices, and embedded control applications. Operating at 300MHz with comprehensive peripheral integration, this microprocessor provides the processing power and connectivity required for demanding real-time applications.

Key Features & Benefits

  • Dual-Core Architecture: ARM926EJ-S main processor paired with C674x signal processing DSP for parallel computation
  • Rich Connectivity: Integrated 10/100Mbps Ethernet, USB 2.0 + PHY, USB 1.1 + PHY, and LCD controller
  • Flexible Interfaces: HPI, I²C, McASP, MMC/SD, SPI, and UART for versatile system integration
  • Industrial Temperature Range: Reliable operation from 0°C to 90°C (TJ) for harsh environments
  • Memory Support: SDRAM controller for high-bandwidth external memory expansion
  • Compact Surface Mount Package: 256-BGA (17x17mm) for space-constrained designs

Ideal Applications

This microprocessor excels in applications requiring both general-purpose processing and intensive signal processing, including industrial HMI systems, motor control with real-time feedback, portable medical instrumentation, audio/video processing equipment, and networked embedded systems.

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Product attributes Property Value
Manufacturer Texas Instruments
Product Series OMAP-L1x
Packaging Tray |
Core Processor ARM926EJ-S
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 300MHz
Co-Processors/DSP Signal Processing; C674x, System Control; CP15
RAM Controllers SDRAM
Graphics Acceleration No
Display & Interface Controllers LCD
Ethernet 10/100Mbps (1)
SATA -
USB USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage - I/O 1.8V, 3.3V
Operating Temperature 0°C ~ 90°C (TJ)
Grade -
Qualification -
Security Features -
Mounting Type Surface Mount
Package / Case 256-BGA
Supplier Device Package 256-BGA (17x17)
Additional Interfaces HPI, I2C, McASP, MMC/SD, SPI, UART
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