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Normaler Preis Dhs. 60.27
Normaler Preis Dhs. 63.46 Verkaufspreis Dhs. 60.27
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15+ Dhs. 58.38 Dhs. 875.70
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50+ Dhs. 53.94 Dhs. 2,697.00
100+ Dhs. 47.60 Dhs. 4,760.00
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Product Overview

The Renesas R9A07G044L24GBG#YJ0 is a high-performance microprocessor from the RZ/G2L series, engineered for demanding applications in industrial automation, automotive systems, medical devices, and telecommunications infrastructure. This advanced MPU combines dual ARM® Cortex®-A55 cores running at 1.2GHz with an ARM® Cortex®-M33 core at 200MHz, delivering exceptional processing power and real-time control capabilities in a single chip.

Key Features & Benefits

  • Heterogeneous Multi-Core Architecture: 3-core design with ARM® Cortex®-A55 (64-bit) for application processing and ARM® Cortex®-M33 for real-time control tasks
  • Advanced Graphics: Integrated ARM® Mali-G31 GPU for enhanced visual performance
  • Flexible Memory Support: Compatible with both DDR3L and DDR4 RAM controllers for scalable memory configurations
  • Dual Gigabit Ethernet: Two 10/100/1000Mbps Ethernet ports for robust network connectivity
  • Industrial-Grade Reliability: Wide operating temperature range (-40°C to 85°C) ensures stable performance in harsh environments
  • Rich Connectivity: USB 2.0, CANbus, eMMC/SD/SDIO, I2C, SPI, UART interfaces for versatile system integration
  • Display Interfaces: MIPI/CSI and MIPI/DSI support for camera and display applications
  • Compact Package: 551-LFBGA (21x21mm) surface mount package optimized for space-constrained designs

Applications

This microprocessor is ideal for:

  • Industrial HMI (Human-Machine Interface) systems
  • Building automation and smart infrastructure
  • Medical imaging and diagnostic equipment
  • Automotive infotainment and gateway systems
  • Network edge computing devices
  • IoT gateways and industrial IoT applications

Technical Specifications Summary

The R9A07G044L24GBG#YJ0 operates at dual I/O voltages (1.8V and 3.3V) and comes in tray packaging. It's RoHS compliant, meeting environmental standards for lead-free manufacturing. The 551-LFBGA package provides excellent thermal performance and signal integrity for high-speed applications.


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Product attributes Property Value
Manufacturer Renesas Electronics Corporation
Product Series RZ/G2L
Packaging Tray |
Core Processor ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width 3 Core, 64-Bit
Speed 200MHz, 1.2GHz
Co-Processors/DSP ARM® Mali-G31
RAM Controllers DDR3L, DDR4
Graphics Acceleration No
Display & Interface Controllers MIPI/CSI, MIPI/DSI
Ethernet 10/100/1000Mbps (2)
SATA -
USB USB 2.0 (2)
Voltage - I/O 1.8V, 3.3V
Operating Temperature -40°C ~ 85°C (TA)
Grade -
Qualification -
Security Features -
Mounting Type Surface Mount
Package / Case 551-LFBGA
Supplier Device Package 551-LFBGA (21x21)
Additional Interfaces CANbus, eMMC/SD/SDIO, I2C, SPI, UART
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.