Texas Instruments TDA3MDDBABFQ1
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 355,874.90 | Dhs. 355,874.90 |
| 15+ | Dhs. 344,636.75 | Dhs. 5,169,551.25 |
| 25+ | Dhs. 337,144.64 | Dhs. 8,428,616.00 |
| 50+ | Dhs. 318,414.39 | Dhs. 15,920,719.50 |
| 100+ | Dhs. 280,953.87 | Dhs. 28,095,387.00 |
| N+ | Dhs. 56,190.77 | Price Inquiry |
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| Product attributes | Property Value |
| Manufacturer | Texas Instruments |
| Product Series | |
| Packaging | | Tape & Reel (TR) |
| Architecture | DSP, MPU |
| Core Processor | ARM® Cortex®-M4, C66x |
| Flash Size | - |
| RAM Size | 512kB |
| Peripherals | DMA, POR, PWM, WDT |
| Connectivity | CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB |
| Speed | 212.8MHz, 500MHz |
| Primary Attributes | - |
| Operating Temperature | -40°C ~ 125°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 367-BFBGA, FCBGA |
| Supplier Device Package | 367-FCBGA (15x15) |
Texas Instruments TDA3MDDBABFQ1 Automotive System-on-Chip
The TDA3MDDBABFQ1 is a high-performance, low-power automotive-grade System-on-Chip (SoC) from Texas Instruments, engineered for advanced driver assistance systems (ADAS), vision processing, and edge computing applications in automotive, industrial, and aerospace environments.
Key Features & Benefits
- Dual-Core Architecture: ARM® Cortex®-M4 (212.8MHz) + C66x DSP (500MHz) for real-time processing and signal analysis
- Automotive-Grade Reliability: Operating temperature range -40°C to 125°C (TJ), designed for harsh environments
- Rich Connectivity: CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB for seamless integration
- Advanced Peripherals: DMA, POR, PWM, WDT for flexible system design
- Compact Package: 367-FCBGA (15x15mm) for space-constrained designs
Ideal Applications
Perfect for automotive vision systems, surround-view cameras, parking assistance, industrial machine vision, robotics control, and aerospace sensor fusion applications requiring robust, real-time processing capabilities.
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