Texas Instruments TDA3MDDBABFQ1

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Normaler Preis Dhs. 355,904.94
Normaler Preis Dhs. 374,636.78 Verkaufspreis Dhs. 355,904.94
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Texas Instruments TDA3MDDBABFQ1 Automotive System-on-Chip

The TDA3MDDBABFQ1 is a high-performance, low-power automotive-grade System-on-Chip (SoC) from Texas Instruments, engineered for advanced driver assistance systems (ADAS), vision processing, and edge computing applications in automotive, industrial, and aerospace environments.

Key Features & Benefits

  • Dual-Core Architecture: ARM® Cortex®-M4 (212.8MHz) + C66x DSP (500MHz) for real-time processing and signal analysis
  • Automotive-Grade Reliability: Operating temperature range -40°C to 125°C (TJ), designed for harsh environments
  • Rich Connectivity: CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB for seamless integration
  • Advanced Peripherals: DMA, POR, PWM, WDT for flexible system design
  • Compact Package: 367-FCBGA (15x15mm) for space-constrained designs

Ideal Applications

Perfect for automotive vision systems, surround-view cameras, parking assistance, industrial machine vision, robotics control, and aerospace sensor fusion applications requiring robust, real-time processing capabilities.

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Product attributes Property Value
Manufacturer Texas Instruments
Product Series
Packaging | Tape & Reel (TR)
Architecture DSP, MPU
Core Processor ARM® Cortex®-M4, C66x
Flash Size -
RAM Size 512kB
Peripherals DMA, POR, PWM, WDT
Connectivity CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB
Speed 212.8MHz, 500MHz
Primary Attributes -
Operating Temperature -40°C ~ 125°C (TJ)
Grade -
Qualification -
Package / Case 367-BFBGA, FCBGA
Supplier Device Package 367-FCBGA (15x15)

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.