Texas Instruments TM4E1231H6NMRI7R
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 355,870.06 | Dhs. 355,870.06 |
| 15+ | Dhs. 344,632.06 | Dhs. 5,169,480.90 |
| 25+ | Dhs. 337,140.05 | Dhs. 8,428,501.25 |
| 50+ | Dhs. 318,410.05 | Dhs. 15,920,502.50 |
| 100+ | Dhs. 280,950.05 | Dhs. 28,095,005.00 |
| N+ | Dhs. 56,190.01 | Price Inquiry |
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| Product attributes | Property Value |
| Manufacturer | Texas Instruments |
| Product Series | |
| Packaging | | Tape & Reel (TR) |
| Core Processor | - |
| Core Size | - |
| Speed | - |
| Connectivity | - |
| Peripherals | - |
| Number of I/O | - |
| Program Memory Size | - |
| Program Memory Type | - |
| EEPROM Size | - |
| RAM Size | - |
| Voltage - Supply (Vcc/Vdd) | - |
| Data Converters | - |
| Oscillator Type | - |
| Operating Temperature | - |
| Grade | - |
| Qualification | - |
| Mounting Type | - |
| Supplier Device Package | - |
| Package / Case | - |
TM4E1231H6NMRI7R - Texas Instruments Sensor Fusion Microcontroller Module
The TM4E1231H6NMRI7R is an advanced sensor fusion microcontroller module from Texas Instruments, designed for high-performance embedded applications requiring integrated sensor processing capabilities. This authentic IC MCU features a 157BGA package configuration, making it ideal for IoT devices, industrial automation, automotive systems, and advanced robotics applications.
Key Features & Benefits
- Sensor Fusion Technology: Integrated processing for combining data from multiple sensors with precision and efficiency
- 157BGA Package: Compact ball grid array packaging for space-constrained designs
- Texas Instruments Quality: Manufactured by TI, ensuring reliability and long-term availability
- Tape & Reel Packaging: Ready for automated assembly and high-volume production
- Authentic Warranty Support: Genuine components with full manufacturer warranty coverage
Applications
This microcontroller module excels in applications requiring sophisticated sensor data processing, including motion tracking, environmental monitoring, gesture recognition, and multi-axis orientation detection. Perfect for engineers developing next-generation embedded systems that demand real-time sensor fusion capabilities.
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TM4E1231H6NMRI7R.pdf