Winbond Electronics W25N01GVSFIG TR

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Normaler Preis Dhs. 8.24
Normaler Preis Dhs. 8.69 Verkaufspreis Dhs. 8.24
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Quantity Unit Price Total Price
1 Dhs. 8.24 Dhs. 8.24
15+ Dhs. 7.99 Dhs. 119.85
25+ Dhs. 7.82 Dhs. 195.50
50+ Dhs. 7.39 Dhs. 369.50
100+ Dhs. 6.52 Dhs. 652.00
N+ Dhs. 1.30 Price Inquiry
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Product attributes Property Value
Manufacturer Winbond Electronics
Product Series SpiFlash®
Packaging Tape & Reel (TR) |
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND (SLC)
Memory Size 1Gbit
Memory Organization 128M x 8
Memory Interface SPI - Quad I/O
Clock Frequency 104 MHz
Write Cycle Time - Word, Page 700µs
Access Time 7 ns
Voltage - Supply 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA)
Grade -
Qualification -
Mounting Type Surface Mount
Package / Case 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package 16-SOIC
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

Premium 1Gbit SPI NAND Flash Memory Solution

The Winbond W25N01GVSFIG TR represents cutting-edge non-volatile memory technology, delivering 1Gbit (128M x 8) of reliable NAND flash storage in a compact 16-SOIC surface-mount package. Engineered for industrial and embedded applications, this SPI NAND flash memory features Quad I/O interface capability for high-speed data transfer at up to 104MHz clock frequency.

Key Technical Advantages

This SpiFlash® series component operates across a wide voltage range (2.7V to 3.6V) and industrial temperature range (-40°C to 85°C), making it ideal for demanding environments. With 7ns access time and 700µs write cycle time, the W25N01GVSFIG TR delivers exceptional performance for embedded systems, IoT devices, automotive electronics, and industrial control applications.

Quality & Authenticity Guaranteed

HQICKEY supplies only authentic Winbond Electronics components with full traceability and RoHS compliance. Each W25N01GVSFIG TR unit comes in tape and reel packaging for automated assembly processes, backed by our technical support team and long lifecycle availability commitment.

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