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Normaler Preis Dhs. 9.37
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15+ Dhs. 9.06 Dhs. 135.90
25+ Dhs. 8.87 Dhs. 221.75
50+ Dhs. 8.37 Dhs. 418.50
100+ Dhs. 7.39 Dhs. 739.00
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Product attributes Property Value
Manufacturer Winbond Electronics
Product Series SpiFlash®
Packaging Tube |
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND (SLC)
Memory Size 1Gbit
Memory Organization 128M x 8
Memory Interface SPI - Quad I/O
Clock Frequency 104 MHz
Write Cycle Time - Word, Page 700µs
Access Time 7 ns
Voltage - Supply 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA)
Grade -
Qualification -
Mounting Type Surface Mount
Package / Case 8-WDFN Exposed Pad
Supplier Device Package 8-WSON (8x6)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

Product Overview

The Winbond W25N01KVZEIE is a high-performance 1Gbit SPI NAND Flash memory device from the renowned SpiFlash® series. Engineered for mission-critical embedded systems, this memory solution delivers exceptional reliability and performance across aerospace, automotive, industrial, and telecommunications applications.

Key Features & Benefits

  • High-Density Storage: 1Gbit (128M x 8) memory organization provides ample capacity for data-intensive applications
  • Fast Performance: 104MHz clock frequency with 7ns access time ensures rapid data retrieval and processing
  • Quad I/O Interface: SPI Quad I/O interface maximizes data throughput for demanding embedded systems
  • Industrial-Grade Reliability: Extended temperature range (-40°C to 85°C) for harsh operating environments
  • SLC NAND Technology: Single-Level Cell architecture delivers superior endurance and data retention
  • Compact Footprint: Space-saving 8-WSON (8x6mm) package with exposed pad for enhanced thermal performance
  • Low Power Operation: 2.7V to 3.6V supply voltage range optimizes power efficiency
  • RoHS Compliant: Environmentally friendly design meets global regulatory standards

This SPI NAND Flash memory features a 700µs write cycle time for efficient page programming operations. The surface mount design facilitates automated assembly processes, while the 8-WDFN exposed pad package ensures optimal heat dissipation in thermally challenging applications.

Applications

Ideal for embedded systems requiring non-volatile storage with high reliability, including automotive infotainment systems, industrial controllers, aerospace data recorders, telecommunications equipment, and IoT devices.

Related Products & Resources

Explore our complete range of memory semiconductor solutions including EEPROM, Flash, DRAM, and SRAM devices. Visit our homepage to discover our full catalog of high-reliability components. Stay informed with the latest industry insights and product announcements on our news blog.

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.