Winbond Electronics W25Q25PWZPIM TR

Zu Produktinformationen springen
1 von 1
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Normaler Preis Dhs. 9.07
Normaler Preis Dhs. 9.55 Verkaufspreis Dhs. 9.07
Sale Ausverkauft
Quantity Unit Price Total Price
1 Dhs. 9.07 Dhs. 9.07
15+ Dhs. 8.79 Dhs. 131.85
25+ Dhs. 8.60 Dhs. 215.00
50+ Dhs. 8.12 Dhs. 406.00
100+ Dhs. 7.16 Dhs. 716.00
N+ Dhs. 1.43 Price Inquiry
Versand wird beim Checkout berechnet
Anzahl
Component Recycling

Request Quote / Inquiry

Product attributes Property Value
Manufacturer Winbond Electronics
Product Series SpiFlash®
Packaging Tape & Reel (TR) | Tape & Reel (TR)
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NOR (SLC)
Memory Size 256Mbit
Memory Organization 32M x 8
Memory Interface SPI - Quad I/O
Clock Frequency 166 MHz
Write Cycle Time - Word, Page 1.5ms
Access Time 4.5 ns
Voltage - Supply 1.65V ~ 1.95V
Operating Temperature -40°C ~ 85°C (TA)
Grade -
Qualification -
Mounting Type Surface Mount
Package / Case 8-WDFN Exposed Pad
Supplier Device Package 8-WSON (6x5)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

Winbond W25Q25PWZPIM TR - High-Performance 256Mbit SPI NOR Flash Memory

The Winbond W25Q25PWZPIM TR is a high-density 256Mbit Serial NOR Flash memory device from the SpiFlash® family, engineered for demanding aerospace, automotive, industrial, and telecommunications applications requiring reliable non-volatile storage with extended temperature range operation.

Key Features & Benefits

  • High-Density Storage: 256Mbit (32MB) capacity organized as 32M x 8, ideal for firmware, code storage, and data logging applications
  • Fast SPI Quad I/O Interface: 166MHz clock frequency with Quad SPI support enables rapid read/write operations for time-critical systems
  • Industrial Temperature Range: -40°C to 85°C operation ensures reliable performance in harsh environmental conditions
  • Low Voltage Operation: 1.65V to 1.95V supply voltage optimizes power efficiency in battery-powered and embedded systems
  • Compact 8-WDFN Package: Space-saving 6x5mm WSON footprint with exposed pad for superior thermal performance
  • Fast Write Performance: 1.5ms page program time and 4.5ns access time support high-throughput applications
  • RoHS Compliant: Meets environmental standards for global deployment

Applications

Ideal for BIOS/firmware storage, embedded systems, industrial controllers, automotive ECUs, telecommunications equipment, IoT devices, and any application requiring reliable, high-speed non-volatile memory with extended temperature operation.

Sourcing Guarantee

Supplied in factory-sealed Tape & Reel packaging from authorized distributor stock. Every unit includes full manufacturer documentation, traceability certification, and long lifecycle support commitment. Genuine Winbond Electronics components with verified authenticity.