Winbond Electronics W632GG8NB11I TR

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Normaler Preis $3.66
Normaler Preis $3.85 Verkaufspreis $3.66
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15+ $3.54 $53.10
25+ $3.47 $86.75
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100+ $2.89 $289.00
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Product attributes Property Value
Manufacturer Winbond Electronics
Product Series
Packaging Tape & Reel (TR) |
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - DDR3
Memory Size 2Gbit
Memory Organization 256M x 8
Memory Interface SSTL_15
Clock Frequency 933 MHz
Write Cycle Time - Word, Page 15ns
Access Time 20 ns
Voltage - Supply 1.425V ~ 1.575V
Operating Temperature -40°C ~ 95°C (TC)
Grade -
Qualification -
Mounting Type Surface Mount
Package / Case 78-VFBGA
Supplier Device Package 78-VFBGA (8x10.5)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

Winbond W632GG8NB11I TR - High-Performance DDR3 SDRAM Memory IC

The Winbond W632GG8NB11I TR is a high-reliability 2Gbit DDR3 SDRAM memory integrated circuit designed for demanding applications in aerospace, automotive, industrial, medical, and telecommunications sectors. Featuring a 256M x 8 memory organization and 933MHz clock frequency, this surface-mount memory IC delivers exceptional performance with SSTL_15 interface compatibility.

Key Features:

  • 2Gbit memory capacity with 256M x 8 organization
  • DDR3 SDRAM technology for high-speed data transfer
  • 933MHz clock frequency with 15ns write cycle time
  • Wide operating temperature range: -40°C to 95°C (TC)
  • Low voltage operation: 1.425V to 1.575V
  • 78-VFBGA (8x10.5) package for space-efficient design
  • RoHS compliant for environmental safety
  • Tape & Reel packaging for automated assembly

Applications: Ideal for embedded systems, industrial controllers, automotive electronics, medical devices, and telecommunications equipment requiring reliable, high-performance volatile memory solutions.

Quality & Compliance: Manufactured by Winbond Electronics with full traceability and RoHS/REACH compliance. Suitable for long lifecycle applications with design-in support available.


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