Zu Produktinformationen springen
1 von 1
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Normaler Preis Dhs. 41.81
Normaler Preis Dhs. 44.02 Verkaufspreis Dhs. 41.81
Sale Ausverkauft
Quantity Unit Price Total Price
1 Dhs. 41.81 Dhs. 41.81
15+ Dhs. 40.50 Dhs. 607.50
25+ Dhs. 39.62 Dhs. 990.50
50+ Dhs. 37.42 Dhs. 1,871.00
100+ Dhs. 33.02 Dhs. 3,302.00
N+ Dhs. 6.60 Price Inquiry
Versand wird beim Checkout berechnet
Anzahl
Component Recycling

Request Quote / Inquiry

Winbond W668GG6TB06J - High-Density DDR4 Memory Solution

The W668GG6TB06J from Winbond Electronics is a premium 8GB DDR4-3200 memory IC engineered for demanding aerospace, automotive, industrial, and telecommunications applications. This industrial-grade component features an X16 interface and operates reliably across an extended temperature range of -40°C to 105°C, making it ideal for mission-critical systems requiring long-term availability and proven performance.

Key Features & Benefits:

  • High-Density 8GB Capacity: DDR4-3200 technology delivers exceptional bandwidth for data-intensive applications
  • Industrial Temperature Range: Operates from -40°C to 105°C for extreme environment reliability
  • X16 Interface: Optimized data path for high-performance system integration
  • Authentic Sourcing: Authorized distributor stock with full manufacturer documentation and traceability
  • Long Lifecycle Commitment: Designed for applications requiring extended product availability
  • RoHS Compliant: Meets environmental standards for global deployment

Applications:

This memory IC is specifically designed for B2B integration in aerospace navigation systems, automotive ADAS platforms, industrial automation controllers, telecommunications infrastructure, and other high-reliability applications where performance, traceability, and long-term support are essential.

All specifications subject to manufacturer documentation. Contact us for detailed datasheets, reference designs, and application notes to support your design-in process.

Product attributes Property Value
Manufacturer Winbond Electronics
Product Series
Packaging Tray | Tray
Memory Type -
Memory Format -
Technology -
Memory Size -
Memory Organization -
Memory Interface -
Clock Frequency -
Write Cycle Time - Word, Page -
Access Time -
Voltage - Supply -
Operating Temperature -
Grade -
Qualification -
Mounting Type -
Package / Case -
Supplier Device Package -
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.