Winbond Electronics W66AP6NBHAFJ
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | $2.97 | $2.97 |
| 15+ | $2.88 | $43.20 |
| 25+ | $2.82 | $70.50 |
| 50+ | $2.66 | $133.00 |
| 100+ | $2.35 | $235.00 |
| N+ | $0.47 | Price Inquiry |
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| Product attributes | Property Value |
| Manufacturer | Winbond Electronics |
| Product Series | |
| Packaging | Tray | |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Technology | SDRAM - Mobile LPDDR4 |
| Memory Size | 1Gbit |
| Memory Organization | 64M x 16 |
| Memory Interface | LVSTL_11 |
| Clock Frequency | 1.6 GHz |
| Write Cycle Time - Word, Page | 18ns |
| Access Time | 3.6 ns |
| Voltage - Supply | 1.06V ~ 1.17V, 1.7V ~ 1.95V |
| Operating Temperature | -40°C ~ 105°C (TC) |
| Grade | - |
| Qualification | - |
| Mounting Type | Surface Mount |
| Package / Case | 100-VFBGA |
| Supplier Device Package | 100-VFBGA (10x7.5) |
| ROHS |  |
The Winbond W66AP6NBHAFJ is a high-performance 1Gbit LPDDR4 SDRAM memory solution engineered for mobile and embedded applications demanding ultra-fast data access and exceptional power efficiency. Built on advanced SDRAM technology, this memory chip delivers reliable performance across extreme temperature ranges from -40°C to 105°C, making it ideal for aerospace, automotive, industrial control systems, and mission-critical telecommunications infrastructure.
Key Performance Features:
- Ultra-Fast Speed: 1.6 GHz clock frequency with lightning-fast 3.6ns access time ensures rapid data retrieval for time-sensitive applications
- Optimized Capacity: 1Gbit memory organized as 64M x 16 provides balanced density for embedded systems
- Low-Power Design: LPDDR4 technology with dual voltage rails (1.06V-1.17V, 1.7V-1.95V) minimizes power consumption
- Industrial-Grade Reliability: Extended temperature range (-40°C to 105°C) ensures stable operation in harsh environments
- Compact Footprint: Space-saving 100-VFBGA package (10x7.5mm) ideal for size-constrained designs
- Industry Compliance: RoHS certified for environmental safety and regulatory compliance
Technical Specifications:
Applications: Mobile devices, automotive infotainment systems, industrial IoT, medical equipment, aerospace avionics, telecommunications infrastructure, embedded computing platforms.
Why Choose HQICKEY? As a trusted distributor of high-reliability semiconductors, we provide authentic Winbond components with full traceability, competitive pricing, and fast worldwide shipping. Our technical support team is ready to assist with integration and design questions.
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- Explore our complete Memory collection - Browse DRAM, SRAM, Flash, and EEPROM solutions from leading manufacturers
- Visit HQICKEY homepage - Discover premium semiconductor components for mission-critical applications
- Read our technical blog - Stay updated on semiconductor trends, application notes, and industry insights
Need assistance with product selection or technical specifications? Contact our engineering team for expert guidance.
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
