Winbond Electronics W66AP6NBHAGJ TR

Zu Produktinformationen springen
1 von 1
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Normaler Preis Dhs. 10.41
Normaler Preis Dhs. 10.98 Verkaufspreis Dhs. 10.41
Sale Ausverkauft
Quantity Unit Price Total Price
1 Dhs. 10.41 Dhs. 10.41
15+ Dhs. 10.10 Dhs. 151.50
25+ Dhs. 9.88 Dhs. 247.00
50+ Dhs. 9.33 Dhs. 466.50
100+ Dhs. 8.24 Dhs. 824.00
N+ Dhs. 1.65 Price Inquiry
Versand wird beim Checkout berechnet
Anzahl
Component Recycling

Request Quote / Inquiry

Product attributes Property Value
Manufacturer Winbond Electronics
Product Series
Packaging Tape & Reel (TR) |
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - Mobile LPDDR4
Memory Size 1Gbit
Memory Organization 64M x 16
Memory Interface LVSTL_11
Clock Frequency 1.867 GHz
Write Cycle Time - Word, Page 18ns
Access Time 3.6 ns
Voltage - Supply 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature -40°C ~ 105°C (TC)
Grade -
Qualification -
Mounting Type Surface Mount
Package / Case 100-VFBGA
Supplier Device Package 100-VFBGA (10x7.5)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

The Winbond W66AP6NBHAGJ TR is a high-performance 1Gbit LPDDR4 SDRAM memory solution engineered for mission-critical applications across aerospace, automotive, industrial, medical, and telecommunications sectors. This mobile LPDDR4 memory delivers exceptional reliability and performance with a 1.867 GHz clock frequency and ultra-fast 3.6 ns access time.

Designed for demanding embedded systems, this memory chip features a 64M x 16 organization and operates across an extended temperature range of -40°C to 105°C, making it ideal for harsh industrial environments. The 100-VFBGA surface mount package ensures compact integration while maintaining robust performance characteristics.

Key Applications:

  • Aerospace and defense embedded systems
  • Automotive infotainment and ADAS platforms
  • Industrial automation and control systems
  • Medical diagnostic equipment
  • Telecommunications infrastructure

Related Resources:

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.