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Product attributes Property Value
Manufacturer Winbond Electronics
Product Series
Packaging Tray |
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - Mobile LPDDR4
Memory Size 1Gbit
Memory Organization 64M x 16
Memory Interface LVSTL_11
Clock Frequency 1.867 GHz
Write Cycle Time - Word, Page 18ns
Access Time 3.6 ns
Voltage - Supply 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature -40°C ~ 105°C (TC)
Grade -
Qualification -
Mounting Type Surface Mount
Package / Case 200-TFBGA
Supplier Device Package 200-TFBGA (10x14.5)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

Winbond W66AP6NBQAGJ - High-Performance 1Gbit LPDDR4 SDRAM for Mobile Applications

The W66AP6NBQAGJ from Winbond Electronics is a premium 1-gigabit Low Power Double Data Rate 4 (LPDDR4) SDRAM designed specifically for mobile and embedded applications requiring high bandwidth and low power consumption. This advanced memory solution delivers exceptional performance with a 1.867 GHz clock frequency and 64M x 16 organization, making it ideal for smartphones, tablets, automotive systems, and IoT devices.

Key Features & Benefits:

  • High-Speed Performance: 1.867 GHz clock frequency with 3.6 ns access time ensures rapid data processing
  • Low Power Design: Dual voltage operation (1.06V-1.17V, 1.7V-1.95V) optimizes energy efficiency for battery-powered devices
  • Extended Temperature Range: -40°C to 105°C (TC) operation supports automotive and industrial applications
  • Compact Footprint: 200-TFBGA (10x14.5mm) surface mount package saves valuable board space
  • Industry Standard: LVSTL_11 interface ensures broad compatibility with mobile processors
  • RoHS Compliant: Environmentally friendly manufacturing meets global standards

Technical Specifications:

Applications:

  • Smartphones and mobile devices
  • Tablets and portable computing
  • Automotive infotainment and ADAS systems
  • Industrial IoT and embedded systems
  • Wearable technology
  • High-performance consumer electronics

Why Choose HQICKEY for Your Memory Components?

As an authorized distributor of Winbond Electronics, HQICKEY guarantees 100% authentic components with full manufacturer traceability. Every W66AP6NBQAGJ IC undergoes rigorous quality control and comes with complete documentation including datasheets, compliance certificates, and technical support. Our global logistics network ensures rapid fulfillment for just-in-time procurement, while our engineering team provides application support to help you integrate this memory solution into your designs.

Explore More Solutions:

Browse our complete Memory IC collection featuring DRAM, Flash, SRAM, and specialized memory solutions from leading manufacturers. Visit the HQICKEY homepage to discover our full catalog of high-reliability semiconductors for aerospace, automotive, industrial, and telecommunications applications. Stay informed about the latest product releases and industry insights on our News blog.

Technical Support & Documentation:

Need assistance with integration, compatibility, or specifications? Our technical team is ready to support your design requirements. Contact us for datasheets, application notes, reference designs, and expert guidance on implementing the W66AP6NBQAGJ in your next project.

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.