Winbond Electronics W66AP6NBUAGJ TR
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | $3.04 | $3.04 |
| 15+ | $2.94 | $44.10 |
| 25+ | $2.88 | $72.00 |
| 50+ | $2.72 | $136.00 |
| 100+ | $2.40 | $240.00 |
| N+ | $0.48 | Price Inquiry |
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| Product attributes | Property Value |
| Manufacturer | Winbond Electronics |
| Product Series | |
| Packaging | Tape & Reel (TR) | |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Technology | SDRAM - Mobile LPDDR4 |
| Memory Size | 1Gbit |
| Memory Organization | 64M x 16 |
| Memory Interface | LVSTL_11 |
| Clock Frequency | 1.867 GHz |
| Write Cycle Time - Word, Page | 18ns |
| Access Time | 3.6 ns |
| Voltage - Supply | 1.06V ~ 1.17V, 1.7V ~ 1.95V |
| Operating Temperature | -40°C ~ 105°C (TC) |
| Grade | - |
| Qualification | - |
| Mounting Type | Surface Mount |
| Package / Case | 200-WFBGA |
| Supplier Device Package | 200-WFBGA (10x14.5) |
| ROHS |  |
Winbond W66AP6NBUAGJ TR - High-Performance Mobile LPDDR4 SDRAM Memory
The Winbond W66AP6NBUAGJ TR is a premium 1Gbit mobile LPDDR4 SDRAM designed for mission-critical applications in aerospace, automotive, industrial, medical, and telecommunications sectors. This high-reliability semiconductor memory delivers exceptional performance with a 1.867 GHz clock frequency and ultra-fast 3.6 ns access time, making it ideal for demanding embedded systems and mobile computing platforms.
Key Features & Benefits
- High-Speed Performance: 1.867 GHz clock frequency with 3.6 ns access time ensures rapid data processing
- Optimized Memory Architecture: 64M x 16 organization provides efficient data management
- Wide Operating Temperature Range: -40°C to 105°C (TC) for extreme environment reliability
- Low Power Consumption: Dual voltage supply (1.06V ~ 1.17V, 1.7V ~ 1.95V) optimizes energy efficiency
- Compact Surface Mount Package: 200-WFBGA (10x14.5) enables space-saving PCB designs
- Industrial-Grade Quality: LVSTL_11 interface ensures robust signal integrity
Applications
This high-reliability LPDDR4 memory is engineered for:
- Aerospace and defense systems requiring extreme temperature tolerance
- Automotive infotainment and ADAS (Advanced Driver Assistance Systems)
- Industrial automation and control systems
- Medical diagnostic and imaging equipment
- Telecommunications infrastructure and 5G network equipment
- High-performance embedded computing platforms
Quality & Compliance
The W66AP6NBUAGJ TR meets stringent quality standards and is RoHS compliant, ensuring environmental responsibility and regulatory compliance for global markets. Manufactured by Winbond Electronics, a trusted leader in semiconductor memory solutions, this component delivers the reliability and performance your critical applications demand.
Related Products & Resources
Explore our comprehensive selection of premium memory solutions for aerospace, automotive, and industrial applications. Visit our homepage to discover our full range of high-reliability semiconductors, or check our technical blog for the latest industry insights and product updates.
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
