Winbond Electronics W66AQ6NBUAGJ TR

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Normaler Preis Dhs. 11.39
Normaler Preis Dhs. 11.99 Verkaufspreis Dhs. 11.39
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Quantity Unit Price Total Price
1 Dhs. 11.39 Dhs. 11.39
15+ Dhs. 11.03 Dhs. 165.45
25+ Dhs. 10.79 Dhs. 269.75
50+ Dhs. 10.19 Dhs. 509.50
100+ Dhs. 8.99 Dhs. 899.00
N+ Dhs. 1.80 Price Inquiry
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Product attributes Property Value
Manufacturer Winbond Electronics
Product Series
Packaging Tape & Reel (TR) |
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - Mobile LPDDR4X
Memory Size 1Gbit
Memory Organization 64M x 16
Memory Interface LVSTL_06
Clock Frequency 1.867 GHz
Write Cycle Time - Word, Page 18ns
Access Time 3.6 ns
Voltage - Supply 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature -40°C ~ 105°C (TC)
Grade -
Qualification -
Mounting Type Surface Mount
Package / Case 200-WFBGA
Supplier Device Package 200-WFBGA (10x14.5)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

Winbond W66AQ6NBUAGJ TR - Premium LPDDR4X SDRAM for Mission-Critical Applications

The Winbond W66AQ6NBUAGJ TR delivers exceptional performance and reliability for demanding mobile and embedded applications. This 1Gbit LPDDR4X SDRAM features advanced 64M x 16 memory organization with a high-speed 1.867 GHz clock frequency, making it ideal for aerospace, automotive, industrial, medical, and telecommunications systems where reliability is paramount.

Engineered for extreme environments, this mobile LPDDR4X memory operates reliably across an extended temperature range of -40°C to 105°C (TC), ensuring consistent performance in harsh conditions. With ultra-fast 3.6 ns access time and dual voltage supply (1.06V ~ 1.17V, 1.7V ~ 1.95V), the W66AQ6NBUAGJ TR provides the perfect balance of speed, power efficiency, and durability for next-generation embedded systems. The compact 200-WFBGA surface mount package (10x14.5mm) enables space-efficient designs without compromising performance.

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