Winbond Electronics W66BP2NQQAFJ
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 14.98 | Dhs. 14.98 |
| 15+ | Dhs. 14.51 | Dhs. 217.65 |
| 25+ | Dhs. 14.19 | Dhs. 354.75 |
| 50+ | Dhs. 13.40 | Dhs. 670.00 |
| 100+ | Dhs. 11.83 | Dhs. 1,183.00 |
| N+ | Dhs. 2.37 | Price Inquiry |
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| Product attributes | Property Value |
| Manufacturer | Winbond Electronics |
| Product Series | |
| Packaging | Tray | Tray |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Technology | SDRAM - Mobile LPDDR4 |
| Memory Size | 2Gbit |
| Memory Organization | 64M x 32 |
| Memory Interface | LVSTL_11 |
| Clock Frequency | 1.6 GHz |
| Write Cycle Time - Word, Page | 18ns |
| Access Time | 3.6 ns |
| Voltage - Supply | 1.06V ~ 1.17V, 1.7V ~ 1.95V |
| Operating Temperature | -40°C ~ 105°C (TC) |
| Grade | - |
| Qualification | - |
| Mounting Type | Surface Mount |
| Package / Case | 200-TFBGA |
| Supplier Device Package | 200-TFBGA (10x14.5) |
| ROHS |  |
Winbond W66BP2NQQAFJ - High-Performance LPDDR4 Mobile DRAM
The W66BP2NQQAFJ from Winbond Electronics is a high-reliability 2Gbit LPDDR4 SDRAM designed for mobile and embedded applications requiring low power consumption and high-speed performance. With a 1.6GHz clock frequency and 3.6ns access time, this memory IC delivers exceptional performance for demanding industrial, automotive, and telecommunications systems.
Key Features & Benefits
- 2Gbit Capacity with 64M x 32 memory organization for flexible system integration
- 1.6GHz Clock Frequency ensures fast data throughput for performance-critical applications
- Extended Temperature Range (-40°C to 105°C) for industrial and automotive environments
- Low Power Operation with dual voltage supply (1.06V-1.17V, 1.7V-1.95V) optimized for mobile devices
- 200-TFBGA Package (10x14.5mm) for space-constrained board designs
- RoHS & REACH Compliant with full traceability and long lifecycle support
Applications
Ideal for automotive infotainment systems, industrial controllers, medical devices, telecommunications equipment, and embedded computing platforms requiring reliable, high-speed memory with extended temperature operation.
Why Choose Our Distribution
As an authorized distributor, we provide genuine Winbond components with full manufacturer traceability, compliance documentation (RoHS/REACH certificates), and long-term availability commitments. All products ship with original packaging and manufacturer warranties.
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
