Winbond Electronics W66BP6NBQAFJ TR

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Normaler Preis Dhs. 10.94
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15+ Dhs. 10.58 Dhs. 158.70
25+ Dhs. 10.35 Dhs. 258.75
50+ Dhs. 9.78 Dhs. 489.00
100+ Dhs. 8.63 Dhs. 863.00
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Product attributes Property Value
Manufacturer Winbond Electronics
Product Series
Packaging Tape & Reel (TR) |
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - Mobile LPDDR4
Memory Size 2Gbit
Memory Organization 128M x 16
Memory Interface LVSTL_11
Clock Frequency 1.6 GHz
Write Cycle Time - Word, Page 18ns
Access Time 3.6 ns
Voltage - Supply 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature -40°C ~ 105°C (TC)
Grade -
Qualification -
Mounting Type Surface Mount
Package / Case 200-TFBGA
Supplier Device Package 200-TFBGA (10x14.5)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

Winbond W66BP6NBQAFJ TR - High-Performance LPDDR4 Mobile Memory Solution

The Winbond W66BP6NBQAFJ TR is a cutting-edge 2Gbit LPDDR4 SDRAM memory chip engineered for demanding mobile, automotive, and industrial applications. This high-reliability semiconductor delivers exceptional performance with a 1.6GHz clock frequency and ultra-fast 3.6ns access time, making it ideal for bandwidth-intensive systems requiring rapid data processing.

Key Features & Benefits

  • High-Speed Performance: 1.6GHz clock frequency with 3.6ns access time ensures rapid data throughput for demanding applications
  • Optimized Memory Architecture: 128M x 16 organization (2Gbit capacity) provides flexible memory configuration
  • Extended Temperature Range: -40°C to 105°C (TC) operation ensures reliability in harsh automotive and industrial environments
  • Low Power Consumption: Dual voltage supply (1.06V-1.17V, 1.7V-1.95V) optimizes power efficiency for mobile devices
  • Industry-Standard Interface: LVSTL_11 interface ensures broad compatibility with modern processors and controllers
  • Compact Surface Mount Package: 200-TFBGA (10x14.5mm) footprint enables space-efficient PCB designs
  • RoHS Compliant: Environmentally friendly manufacturing meets global regulatory standards

Applications

This LPDDR4 memory solution is perfectly suited for:

  • Automotive infotainment and ADAS systems
  • Industrial IoT and edge computing devices
  • Mobile telecommunications equipment
  • High-performance embedded systems
  • Medical diagnostic equipment
  • Aerospace and defense applications

Why Choose Winbond Memory Solutions?

Winbond Electronics is a globally recognized leader in semiconductor memory solutions, delivering high-reliability components for mission-critical applications. The W66BP6NBQAFJ TR combines proven LPDDR4 technology with rigorous quality standards, ensuring consistent performance across extended temperature ranges and demanding operational conditions.

Related Products & Resources

Explore our complete range of memory solutions for aerospace, automotive, industrial, and telecommunications applications. Visit our homepage to discover our full semiconductor portfolio, or read our technical blog for the latest industry insights and application notes.

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.