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Normaler Preis Dhs. 13.64
Normaler Preis Dhs. 14.35 Verkaufspreis Dhs. 13.64
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1 Dhs. 13.64 Dhs. 13.64
15+ Dhs. 13.20 Dhs. 198.00
25+ Dhs. 12.92 Dhs. 323.00
50+ Dhs. 12.20 Dhs. 610.00
100+ Dhs. 10.76 Dhs. 1,076.00
N+ Dhs. 2.15 Price Inquiry
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Product attributes Property Value
Manufacturer Winbond Electronics
Product Series
Packaging Tray |
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - Mobile LPDDR4
Memory Size 2Gbit
Memory Organization 128M x 16
Memory Interface LVSTL_11
Clock Frequency 1.6 GHz
Write Cycle Time - Word, Page 18ns
Access Time 3.5 ns
Voltage - Supply 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature -40°C ~ 105°C (TC)
Grade -
Qualification -
Mounting Type Surface Mount
Package / Case 200-WFBGA
Supplier Device Package 200-WFBGA (10x14.5)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

Winbond W66BP6NBUAFJ - High-Performance Mobile LPDDR4 SDRAM

The W66BP6NBUAFJ from Winbond Electronics is a high-reliability 2Gbit LPDDR4 SDRAM designed for demanding mobile and embedded applications. Featuring a 128M x 16 memory organization and 1.6GHz clock frequency, this volatile DRAM delivers exceptional performance with ultra-fast 3.5ns access time.

Key Features & Benefits

  • High-Speed Performance: 1.6GHz clock frequency with 3.5ns access time for rapid data processing
  • Mobile-Optimized: LPDDR4 technology designed specifically for power-efficient mobile applications
  • Wide Operating Range: -40°C to 105°C (TC) for industrial-grade reliability
  • Compact Surface Mount: 200-WFBGA (10x14.5mm) package saves valuable board space
  • RoHS Compliant: Environmentally friendly and meets global compliance standards
  • Dual Voltage Supply: 1.06V ~ 1.17V and 1.7V ~ 1.95V for flexible system integration

Applications

Ideal for smartphones, tablets, automotive infotainment systems, IoT devices, and other mobile computing platforms requiring high-speed, low-power memory solutions.

Documentation & Support

Full datasheet and technical documentation available. Our engineering team provides design-in support to ensure seamless integration into your application.

Part Number: W66BP6NBUAFJ
Manufacturer: Winbond Electronics
Package: Tray packaging available for production volumes


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