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Normaler Preis Dhs. 13.94
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Product attributes Property Value
Manufacturer Winbond Electronics
Product Series
Packaging Tray |
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - Mobile LPDDR4
Memory Size 2Gbit
Memory Organization 128M x 16
Memory Interface LVSTL_11
Clock Frequency 2.133 GHz
Write Cycle Time - Word, Page 18ns
Access Time 3.5 ns
Voltage - Supply 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature -40°C ~ 105°C (TC)
Grade -
Qualification -
Mounting Type Surface Mount
Package / Case 200-WFBGA
Supplier Device Package 200-WFBGA (10x14.5)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

Winbond W66BP6NBUAHJ - 2Gbit Mobile LPDDR4 SDRAM Memory IC

The W66BP6NBUAHJ from Winbond Electronics is a high-performance 2Gbit mobile LPDDR4 SDRAM designed for demanding applications in automotive, industrial, medical, and telecommunications sectors. Featuring a 128M x 16 memory organization and operating at 2.133 GHz, this memory IC delivers exceptional speed and reliability across an extended temperature range of -40°C to 105°C.

Key Features:

  • 2Gbit LPDDR4 SDRAM with 128M x 16 organization
  • High-speed operation at 2.133 GHz clock frequency
  • Ultra-fast 3.5 ns access time and 18 ns write cycle
  • Wide operating temperature range: -40°C to 105°C (TC)
  • Dual voltage supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
  • Compact 200-WFBGA (10x14.5mm) surface mount package
  • RoHS compliant for environmental safety
  • LVSTL_11 memory interface

Applications: Mobile devices, automotive infotainment systems, industrial control systems, medical equipment, telecommunications infrastructure, and embedded computing platforms requiring high-density, high-speed volatile memory with extended temperature tolerance.

Backed by Winbond's reputation for quality and reliability, the W66BP6NBUAHJ offers full traceability and compliance documentation (RoHS/REACH) to support your design-in requirements and production-scale sourcing needs.


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