Winbond Electronics W66BQ2NQQAGJ TR
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 13.71 | Dhs. 13.71 |
| 15+ | Dhs. 13.27 | Dhs. 199.05 |
| 25+ | Dhs. 12.98 | Dhs. 324.50 |
| 50+ | Dhs. 12.26 | Dhs. 613.00 |
| 100+ | Dhs. 10.82 | Dhs. 1,082.00 |
| N+ | Dhs. 2.16 | Price Inquiry |
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| Product attributes | Property Value |
| Manufacturer | Winbond Electronics |
| Product Series | |
| Packaging | Tape & Reel (TR) | |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Technology | SDRAM - Mobile LPDDR4X |
| Memory Size | 2Gbit |
| Memory Organization | 64M x 32 |
| Memory Interface | LVSTL_06 |
| Clock Frequency | 1.867 GHz |
| Write Cycle Time - Word, Page | 18ns |
| Access Time | 3.6 ns |
| Voltage - Supply | 1.06V ~ 1.17V, 1.7V ~ 1.95V |
| Operating Temperature | -40°C ~ 105°C (TC) |
| Grade | - |
| Qualification | - |
| Mounting Type | Surface Mount |
| Package / Case | 200-TFBGA |
| Supplier Device Package | 200-TFBGA (10x14.5) |
| ROHS |  |
Winbond W66BQ2NQQAGJ TR - High-Performance Mobile LPDDR4X SDRAM
The Winbond W66BQ2NQQAGJ TR is a high-reliability 2Gbit LPDDR4X SDRAM designed for demanding mobile and embedded applications. Engineered for superior performance and energy efficiency, this memory IC delivers exceptional speed with a 1.867 GHz clock frequency and ultra-fast 3.6ns access time.
Key Features & Benefits
- High-Speed Performance: 1.867 GHz clock frequency with 3.6ns access time for responsive system operation
- Optimized Memory Architecture: 2Gbit capacity with 64M x 32 organization for efficient data handling
- Wide Operating Temperature Range: -40°C to 105°C (TC) ensures reliable operation in harsh environments
- Low Power Consumption: LPDDR4X technology with dual voltage supply (1.06V-1.17V, 1.7V-1.95V) for extended battery life
- Compact Surface Mount Package: 200-TFBGA (10x14.5mm) for space-constrained designs
- RoHS Compliant: Environmentally friendly and meets global regulatory standards
Ideal Applications
Perfect for mobile devices, smartphones, tablets, automotive infotainment systems, IoT devices, and embedded computing platforms requiring high-speed, low-power memory solutions with extended temperature tolerance.
Quality & Compliance
Manufactured by Winbond Electronics, a trusted leader in semiconductor memory solutions. This component is RoHS compliant and backed by comprehensive technical documentation and design support resources.
Packaging: Available in Tape & Reel (TR) for automated assembly processes, ensuring efficient production integration and component protection.
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