Winbond Electronics W66BQ2NQUAFJ
Normaler Preis
Dhs. 15.70
Normaler Preis
Dhs. 16.52
Verkaufspreis
Dhs. 15.70
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 15.70 | Dhs. 15.70 |
| 15+ | Dhs. 15.20 | Dhs. 228.00 |
| 25+ | Dhs. 14.87 | Dhs. 371.75 |
| 50+ | Dhs. 14.04 | Dhs. 702.00 |
| 100+ | Dhs. 12.39 | Dhs. 1,239.00 |
| N+ | Dhs. 2.48 | Price Inquiry |
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| Product attributes | Property Value |
| Manufacturer | Winbond Electronics |
| Product Series | |
| Packaging | Tray | Tray |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Technology | SDRAM - Mobile LPDDR4X |
| Memory Size | 2Gbit |
| Memory Organization | 64M x 32 |
| Memory Interface | LVSTL_06 |
| Clock Frequency | 1.6 GHz |
| Write Cycle Time - Word, Page | 18ns |
| Access Time | 3.6 ns |
| Voltage - Supply | 1.06V ~ 1.17V, 1.7V ~ 1.95V |
| Operating Temperature | -40°C ~ 105°C (TC) |
| Grade | - |
| Qualification | - |
| Mounting Type | Surface Mount |
| Package / Case | 200-WFBGA |
| Supplier Device Package | 200-WFBGA (10x14.5) |
| ROHS |  |
Winbond W66BQ2NQUAFJ - High-Performance LPDDR4X Mobile DRAM
The Winbond W66BQ2NQUAFJ is a 2-gigabit low-power DDR4X (LPDDR4X) SDRAM designed for mobile and embedded applications requiring high bandwidth, low power consumption, and reliable performance across extended temperature ranges.
Key Features & Benefits
- High-Speed Performance: 1.6 GHz clock frequency with ultra-fast 3.6ns access time delivers exceptional data throughput for demanding mobile workloads
- Optimized Memory Architecture: 64M x 32 organization (2Gbit capacity) provides flexible integration for smartphones, tablets, automotive systems, and IoT devices
- Low Power Consumption: LPDDR4X technology with dual voltage rails (1.06V-1.17V core, 1.7V-1.95V I/O) minimizes energy usage and extends battery life
- Industrial Temperature Range: -40°C to 105°C (TC) operation ensures reliability in automotive, industrial control, and harsh-environment applications
- Compact Surface Mount Package: 200-WFBGA (10mm x 14.5mm) footprint enables space-efficient PCB layouts for mobile form factors
- RoHS Compliant: Meets environmental standards for global market deployment
Target Applications
Ideal for smartphones, tablets, automotive infotainment systems, industrial IoT devices, AI edge computing modules, wearables, and any mobile platform requiring high-performance, low-power memory with extended lifecycle support.
All specifications are subject to manufacturer updates. Please consult the official Winbond datasheet for complete electrical characteristics, timing diagrams, and application guidelines.
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
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