AMD XAZU1EG-1SFVA625Q
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 2,359.45 | Dhs. 2,359.45 |
| 15+ | Dhs. 2,284.94 | Dhs. 34,274.10 |
| 25+ | Dhs. 2,235.27 | Dhs. 55,881.75 |
| 50+ | Dhs. 2,111.09 | Dhs. 105,554.50 |
| 100+ | Dhs. 1,862.72 | Dhs. 186,272.00 |
| N+ | Dhs. 372.54 | Price Inquiry |
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AMD Zynq® UltraScale+™ MPSoC EG - XAZU1EG-1SFVA625Q
The XAZU1EG-1SFVA625Q is a high-performance System-on-Chip (SoC) from AMD's Zynq® UltraScale+™ MPSoC EG series, combining powerful ARM® processing cores with programmable FPGA logic for demanding embedded applications in aerospace, automotive, industrial automation, medical devices, and telecommunications.
Key Features & Benefits
- Heterogeneous Multi-Core Processing: Quad ARM® Cortex®-A53 MPCore™ (up to 1.2GHz) for application processing, Dual ARM® Cortex™-R5 (up to 600MHz) for real-time control, plus ARM Mali™-400 MP2 GPU for graphics acceleration
- 82K Logic Cell FPGA: Programmable logic fabric enables custom hardware acceleration, signal processing, and I/O interfacing
- 256KB On-Chip RAM: High-speed memory for critical data and processing tasks
- Rich Connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO, and EBI/EMI interfaces support diverse system architectures
- Industrial Temperature Range: -40°C to 125°C (TJ) operation ensures reliability in harsh environments
- Compact 625-FCBGA Package: 21x21mm footprint optimizes board space while delivering high I/O density
- RoHS Compliant: Meets environmental standards for global deployment
Ideal Applications
- Aerospace & defense embedded systems
- Automotive ADAS and infotainment platforms
- Industrial automation and robotics controllers
- Medical imaging and diagnostic equipment
- 5G/telecom infrastructure and base stations
- High-performance edge computing and AI inference
Design Support & Resources
Full technical documentation, reference designs, development tools, and design-in support available. Our engineering team provides traceability documentation, compliance certificates (RoHS/REACH), and lifecycle management for production deployments.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC EG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 600MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 82K Logic Cells |
| Operating Temperature | -40°C ~ 125°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 625-BFBGA, FCBGA |
| Supplier Device Package | 625-FCBGA (21x21) |
| ROHS |

XAZU1EG-1SFVA625Q.pdf