AMD XAZU3EG-L1SFVC784I

Zu Produktinformationen springen
1 von 1
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Normaler Preis Dhs. 2,873.24
Normaler Preis Dhs. 3,024.44 Verkaufspreis Dhs. 2,873.24
Sale Ausverkauft
Quantity Unit Price Total Price
1 Dhs. 2,873.24 Dhs. 2,873.24
15+ Dhs. 2,782.48 Dhs. 41,737.20
25+ Dhs. 2,722.00 Dhs. 68,050.00
50+ Dhs. 2,570.77 Dhs. 128,538.50
100+ Dhs. 2,268.33 Dhs. 226,833.00
N+ Dhs. 453.67 Price Inquiry
Versand wird beim Checkout berechnet
Anzahl
Component Recycling

Request Quote / Inquiry

AMD Zynq UltraScale+ MPSoC EG - XAZU3EG-L1SFVC784I

The AMD XAZU3EG-L1SFVC784I is a high-performance System-on-Chip (SoC) combining programmable logic with processing power, designed for mission-critical applications in aerospace, automotive, industrial automation, medical devices, and telecommunications.

Key Features

  • Quad ARM Cortex-A53 MPCore with CoreSight at 1.2GHz for application processing
  • Dual ARM Cortex-R5 with CoreSight at 500MHz for real-time control
  • ARM Mali-400 MP2 GPU for graphics acceleration
  • 154K+ Logic Cells FPGA fabric for custom hardware acceleration
  • 1.8MB On-Chip RAM for high-speed data processing
  • Industrial Temperature Range: -40°C to 100°C (TJ)
  • RoHS Compliant for environmental safety

Connectivity & Peripherals

Comprehensive connectivity options including CANbus, I²C, SPI, UART/USART, and USB, plus integrated DMA and Watchdog Timer (WDT) for robust system design.

Applications

  • Aerospace and defense systems
  • Automotive ADAS and infotainment
  • Industrial automation and robotics
  • Medical imaging and diagnostic equipment
  • 5G telecommunications infrastructure

Package & Availability

Supplied in 784-FCBGA (23x23mm) package, tray packaging. Active part status with full traceability and long lifecycle support.


Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™ MPSoC EG
Packaging Tray |
Part Status Active
Architecture MPU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size -
RAM Size 1.8MB
Peripherals DMA, WDT
Connectivity CANbus, I2C, SPI, UART/USART, USB
Speed 500MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 784-BFBGA, FCBGA
Supplier Device Package 784-FCBGA (23x23)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.