AMD XC2VP4-5FG256C

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Normaler Preis Dhs. 355,870.06
Normaler Preis Dhs. 374,600.06 Verkaufspreis Dhs. 355,870.06
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1 Dhs. 355,870.06 Dhs. 355,870.06
15+ Dhs. 344,632.06 Dhs. 5,169,480.90
25+ Dhs. 337,140.05 Dhs. 8,428,501.25
50+ Dhs. 318,410.05 Dhs. 15,920,502.50
100+ Dhs. 280,950.05 Dhs. 28,095,005.00
N+ Dhs. 56,190.01 Price Inquiry
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Product attributes Property Value
Manufacturer AMD
Product Series Virtex®-II Pro
Packaging | Tray
Number of LABs/CLBs 752
Number of Logic Elements/Cells 6768
Total RAM Bits 516096
Number of I/O 140
Number of Gates -
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Grade -
Qualification -
Package / Case 256-BGA
Supplier Device Package 256-FBGA (17x17)

AMD Virtex-II Pro XC2VP4-5FG256C FPGA - High-Reliability Programmable Logic

The XC2VP4-5FG256C is a high-performance FPGA from AMD's Virtex®-II Pro series, engineered for demanding applications in aerospace, industrial automation, telecommunications, and embedded systems. This device delivers exceptional logic density with 6768 logic elements and 516096 RAM bits in a compact 256-FBGA package.

Key Features & Benefits

  • High Logic Density: 752 CLBs with 6768 logic elements for complex design implementation
  • Extensive Memory: 516096 total RAM bits for data-intensive applications
  • Flexible I/O: 140 I/O pins supporting multiple interface standards
  • Industrial Temperature Range: 0°C to 85°C (TJ) for reliable operation in harsh environments
  • Compact Footprint: 256-FBGA (17x17mm) package optimized for space-constrained designs
  • Surface Mount Technology: Enables automated assembly and high-density PCB layouts

Applications

Ideal for high-reliability systems requiring long lifecycle support including industrial control, medical devices, automotive electronics, aerospace instrumentation, and telecommunications infrastructure.

Quality & Compliance

Supplied with full manufacturer traceability, RoHS/REACH compliant. Authorized distribution ensures authentic components with complete documentation and long-term availability commitment.