AMD XC2VP50-6FF1152C

Zu Produktinformationen springen
1 von 1
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Normaler Preis Dhs. 355,889.44
Normaler Preis Dhs. 374,620.46 Verkaufspreis Dhs. 355,889.44
Sale Ausverkauft
Quantity Unit Price Total Price
1 Dhs. 355,889.44 Dhs. 355,889.44
15+ Dhs. 344,650.82 Dhs. 5,169,762.30
25+ Dhs. 337,158.41 Dhs. 8,428,960.25
50+ Dhs. 318,427.39 Dhs. 15,921,369.50
100+ Dhs. 280,965.35 Dhs. 28,096,535.00
N+ Dhs. 56,193.07 Price Inquiry
Versand wird beim Checkout berechnet
Anzahl
Component Recycling

Request Quote / Inquiry

AMD XC2VP50-6FF1152C Virtex-II Pro FPGA - High-Performance Programmable Logic for Mission-Critical Applications

The AMD XC2VP50-6FF1152C is a high-reliability, high-performance FPGA from the proven Virtex®-II Pro family, specifically engineered for demanding applications in aerospace, defense, industrial automation, telecommunications infrastructure, and medical systems. This device delivers exceptional computational power with 53,136 logic elements, 692 user I/O pins, and over 4.2 million RAM bits—all in a compact, thermally efficient 1152-FCBGA surface-mount package.

Why Choose the XC2VP50-6FF1152C?

  • Massive Logic Capacity: 5,904 configurable logic blocks (CLBs) with 53,136 logic cells enable complex algorithm implementation, real-time signal processing, and multi-function system integration on a single chip
  • Extensive I/O Flexibility: 692 user I/O pins support diverse interface standards including LVDS, LVTTL, LVCMOS, and high-speed serial protocols for seamless system connectivity
  • Large Embedded Memory: 4,276,224 total RAM bits provide ample on-chip storage for data buffering, lookup tables, FIFO queues, and embedded processor memory
  • Industrial-Grade Reliability: Qualified for 0°C to 85°C junction temperature operation, ensuring stable performance in harsh industrial and outdoor environments
  • Flexible Power Architecture: 1.425V to 1.575V core voltage range supports power optimization strategies and compatibility with standard power supply designs
  • Space-Efficient Packaging: Compact 35mm × 35mm 1152-ball fine-pitch BGA footprint maximizes board density in space-constrained applications

Target Applications

The XC2VP50-6FF1152C excels in:

  • High-speed digital signal processing (DSP) and software-defined radio (SDR)
  • Embedded vision systems and real-time image processing
  • Communications infrastructure: base stations, routers, switches, and protocol converters
  • Test and measurement equipment requiring reconfigurable logic
  • Industrial control systems and programmable automation controllers (PAC)
  • Medical imaging and diagnostic equipment
  • Aerospace and defense systems with long-term availability requirements

Authorized Distribution & Quality Assurance

As an authorized AMD distributor, we guarantee:

  • ✓ 100% authentic components with full manufacturer traceability
  • ✓ Complete technical documentation and datasheets
  • ✓ RoHS and REACH compliance certification
  • ✓ Long lifecycle commitment to support your design-in requirements
  • ✓ Expert technical support for design integration and troubleshooting

Order with Confidence

Stock availability, volume pricing, and custom packaging options available. Contact our technical sales team for design support, lead time confirmation, and quantity discounts for production orders.

Product attributes Property Value
Manufacturer AMD
Product Series Virtex®-II Pro
Packaging | Tray
Number of LABs/CLBs 5904
Number of Logic Elements/Cells 53136
Total RAM Bits 4276224
Number of I/O 692
Number of Gates -
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Grade -
Qualification -
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FCBGA (35x35)