AMD XC3S2000-4FGG676I
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 754.15 | Dhs. 754.15 |
| 15+ | Dhs. 730.31 | Dhs. 10,954.65 |
| 25+ | Dhs. 714.44 | Dhs. 17,861.00 |
| 50+ | Dhs. 674.75 | Dhs. 33,737.50 |
| 100+ | Dhs. 595.37 | Dhs. 59,537.00 |
| N+ | Dhs. 119.07 | Price Inquiry |
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AMD Spartan-3 XC3S2000-4FGG676I FPGA - Industrial Grade
The XC3S2000-4FGG676I is a high-performance FPGA from AMD's proven Spartan-3 family, delivering 2 million system gates in a compact 676-ball fine-pitch BGA package. Designed for demanding industrial, automotive, aerospace, and telecommunications applications requiring extended temperature operation and long lifecycle availability.
Key Features & Benefits
- High Logic Density: 5,120 CLBs with 46,080 logic cells for complex digital designs
- Extensive I/O: 489 user I/O pins supporting multiple standards for flexible system integration
- On-Chip Memory: 737,280 bits of distributed and block RAM for data buffering and processing
- Industrial Temperature Range: -40°C to +100°C junction temperature for harsh environments
- Compact Footprint: 676-FBGA (27mm × 27mm) surface-mount package optimizes board space
- Authorized Stock: Full manufacturer documentation, traceability, and warranty support
Ideal Applications
Perfect for aerospace avionics, automotive control systems, industrial automation, telecommunications infrastructure, medical devices, and defense systems requiring proven reliability and long-term availability.
Documentation & Support: Full AMD datasheets, reference designs, and technical resources available. Contact our design-in support team for application assistance and long-term availability commitments.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Spartan®-3 |
| Packaging | Tray | Tray |
| Number of LABs/CLBs | 5120 |
| Number of Logic Elements/Cells | 46080 |
| Total RAM Bits | 737280 |
| Number of I/O | 489 |
| Number of Gates | 2000000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 676-BGA |
| Supplier Device Package | 676-FBGA (27x27) |
| ROHS |

XC3S2000-4FGG676I.pdf