AMD XC7Z010-2CLG225I

Zu Produktinformationen springen
1 von 1
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Normaler Preis Dhs. 352.28
Normaler Preis Dhs. 370.83 Verkaufspreis Dhs. 352.28
Sale Ausverkauft
Quantity Unit Price Total Price
1 Dhs. 352.28 Dhs. 352.28
15+ Dhs. 341.16 Dhs. 5,117.40
25+ Dhs. 333.75 Dhs. 8,343.75
50+ Dhs. 315.21 Dhs. 15,760.50
100+ Dhs. 278.12 Dhs. 27,812.00
N+ Dhs. 55.62 Price Inquiry
Versand wird beim Checkout berechnet
Anzahl
Component Recycling

Request Quote / Inquiry

AMD XC7Z010-2CLG225I Zynq-7000 SoC FPGA - High-Performance Embedded Processing

The XC7Z010-2CLG225I from AMD (formerly Xilinx) combines the flexibility of programmable logic with the power of dual ARM Cortex-A9 processors, delivering exceptional performance for industrial, automotive, medical, and aerospace applications requiring real-time processing and hardware acceleration.

Key Features & Benefits

  • Dual ARM Cortex-A9 MPCore with CoreSight: 766MHz processing power for demanding embedded applications
  • Artix-7 FPGA Architecture: 28,000 logic cells for custom hardware acceleration and I/O flexibility
  • Rich Connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO interfaces
  • Industrial Temperature Range: -40°C to 100°C (TJ) for harsh environment deployment
  • Compact 225-CSPBGA Package: 13x13mm footprint for space-constrained designs
  • RoHS Compliant: Meets environmental standards for global distribution

Ideal Applications

Perfect for motor control, industrial automation, medical imaging, automotive ADAS systems, aerospace avionics, and any application requiring the combination of real-time processing with FPGA-based hardware acceleration and custom I/O.

Design Resources & Support

Full datasheets, reference designs, development tools, and technical documentation available. Our engineering team provides design-in support to help you integrate this SoC into your next-generation embedded system.

Stock Status: Active production part with full traceability and long lifecycle availability for production-scale deployments.

Product attributes Property Value
Manufacturer AMD
Product Series Zynq®-7000
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 766MHz
Primary Attributes Artix™-7 FPGA, 28K Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 225-LFBGA, CSPBGA
Supplier Device Package 225-CSPBGA (13x13)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY