AMD XC7Z030-1FBG676I

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Normaler Preis Dhs. 1,332.40
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100+ Dhs. 1,051.89 Dhs. 105,189.00
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AMD Zynq-7000 SoC XC7Z030-1FBG676I - High-Performance Programmable System-on-Chip

The XC7Z030-1FBG676I from AMD's Zynq-7000 family combines the flexibility of programmable logic with the performance of a dual-core ARM Cortex-A9 processor, delivering exceptional processing power for aerospace, automotive, industrial, medical, and telecommunications applications.

Key Features & Benefits

  • Dual ARM Cortex-A9 MPCore with CoreSight: High-performance 667MHz processing for demanding embedded applications
  • Kintex-7 FPGA with 125K Logic Cells: Programmable logic fabric for custom hardware acceleration and I/O flexibility
  • 256KB On-Chip RAM: Fast memory for real-time processing and data buffering
  • Rich Connectivity Options: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO, and EBI/EMI interfaces
  • Industrial Temperature Range: Operates reliably from -40°C to 100°C (TJ) for harsh environments
  • RoHS Compliant: Meets environmental and safety standards for global deployment
  • 676-FCBGA Package: Compact 27x27mm footprint with excellent thermal performance

Ideal Applications

This versatile SoC is engineered for design-in projects requiring both processing power and FPGA flexibility, including motor control systems, industrial automation, medical imaging equipment, aerospace avionics, automotive ADAS, and high-speed communication infrastructure.

Quality & Compliance

As an authorized distributor, we provide full traceability documentation, RoHS/REACH compliance certificates, and datasheets with every order. All components are sourced directly from AMD or authorized channels, ensuring authenticity and long lifecycle availability for production-scale deployments.

Need design-in support? Our engineering team can provide reference designs, technical documentation, and application guidance to accelerate your development cycle.

Product attributes Property Value
Manufacturer AMD
Product Series Zynq®-7000
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 667MHz
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY