AMD XC7Z030-1FBG676I
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 1,332.40 | Dhs. 1,332.40 |
| 15+ | Dhs. 1,290.32 | Dhs. 19,354.80 |
| 25+ | Dhs. 1,262.27 | Dhs. 31,556.75 |
| 50+ | Dhs. 1,192.14 | Dhs. 59,607.00 |
| 100+ | Dhs. 1,051.89 | Dhs. 105,189.00 |
| N+ | Dhs. 210.38 | Price Inquiry |
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AMD Zynq-7000 SoC XC7Z030-1FBG676I - High-Performance Programmable System-on-Chip
The XC7Z030-1FBG676I from AMD's Zynq-7000 family combines the flexibility of programmable logic with the performance of a dual-core ARM Cortex-A9 processor, delivering exceptional processing power for aerospace, automotive, industrial, medical, and telecommunications applications.
Key Features & Benefits
- Dual ARM Cortex-A9 MPCore with CoreSight: High-performance 667MHz processing for demanding embedded applications
- Kintex-7 FPGA with 125K Logic Cells: Programmable logic fabric for custom hardware acceleration and I/O flexibility
- 256KB On-Chip RAM: Fast memory for real-time processing and data buffering
- Rich Connectivity Options: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO, and EBI/EMI interfaces
- Industrial Temperature Range: Operates reliably from -40°C to 100°C (TJ) for harsh environments
- RoHS Compliant: Meets environmental and safety standards for global deployment
- 676-FCBGA Package: Compact 27x27mm footprint with excellent thermal performance
Ideal Applications
This versatile SoC is engineered for design-in projects requiring both processing power and FPGA flexibility, including motor control systems, industrial automation, medical imaging equipment, aerospace avionics, automotive ADAS, and high-speed communication infrastructure.
Quality & Compliance
As an authorized distributor, we provide full traceability documentation, RoHS/REACH compliance certificates, and datasheets with every order. All components are sourced directly from AMD or authorized channels, ensuring authenticity and long lifecycle availability for production-scale deployments.
Need design-in support? Our engineering team can provide reference designs, technical documentation, and application guidance to accelerate your development cycle.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq®-7000 |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 667MHz |
| Primary Attributes | Kintex™-7 FPGA, 125K Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27x27) |
| ROHS |

XC7Z030-1FBG676I.pdf