AMD XC7Z030-2FBG676I

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Normaler Preis Dhs. 1,600.79
Normaler Preis Dhs. 1,685.04 Verkaufspreis Dhs. 1,600.79
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AMD Zynq-7000 XC7Z030-2FBG676I System-on-Chip FPGA

The XC7Z030-2FBG676I is a high-performance System-on-Chip (SoC) from AMD's Zynq-7000 family, combining dual ARM Cortex-A9 MPCore processors with Kintex-7 FPGA fabric. This industrial-grade device delivers 800MHz processing speed with 125K logic cells, making it ideal for demanding embedded applications in automotive, aerospace, industrial automation, and communications systems.

Key Features:

  • Dual ARM Cortex-A9 MPCore with CoreSight debug technology running at 800MHz
  • Kintex-7 FPGA fabric with 125,000 logic cells for custom hardware acceleration
  • 256KB RAM for embedded processing tasks
  • Rich connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO
  • Industrial temperature range: -40°C to 100°C (TJ) for harsh environments
  • 676-FCBGA package (27x27mm) for space-efficient designs
  • RoHS compliant for environmental safety

This active production device ships in tray packaging and is backed by comprehensive AMD documentation and development tools. Perfect for engineers developing high-reliability embedded systems requiring both programmable logic and processor integration.

Product attributes Property Value
Manufacturer AMD
Product Series Zynq®-7000
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY