AMD XC7Z030-2FF676I
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 2,502.85 | Dhs. 2,502.85 |
| 15+ | Dhs. 2,423.80 | Dhs. 36,357.00 |
| 25+ | Dhs. 2,371.10 | Dhs. 59,277.50 |
| 50+ | Dhs. 2,239.38 | Dhs. 111,969.00 |
| 100+ | Dhs. 1,975.92 | Dhs. 197,592.00 |
| N+ | Dhs. 395.18 | Price Inquiry |
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AMD XC7Z030-2FF676I Zynq-7000 SoC – Dual ARM Cortex-A9 with Kintex-7 FPGA
High-Performance System-on-Chip for Industrial, Aerospace & Automotive Applications
The AMD XC7Z030-2FF676I is an industrial-grade System-on-Chip (SoC) from the proven Zynq-7000 family, integrating dual ARM Cortex-A9 MPCore processors running at 800MHz with CoreSight debug technology and a powerful Kintex-7 FPGA fabric featuring 125,000 logic cells. This architecture delivers the flexibility of programmable logic combined with the performance of embedded processors in a single, compact device.
With 256KB on-chip RAM and comprehensive connectivity including Ethernet, USB OTG, CANbus, SPI, I2C, UART/USART, and MMC/SD/SDIO, the XC7Z030 enables rapid development of complex embedded systems. The industrial temperature range of -40°C to 100°C (TJ) ensures reliable operation in the harshest environments, from factory floors to aerospace applications.
Key Technical Features
- Dual ARM Cortex-A9 MPCore processors with CoreSight debug at 800MHz for high-performance embedded processing
- Kintex-7 FPGA fabric with 125,000 logic cells for custom hardware acceleration and real-time signal processing
- 256KB on-chip RAM for fast data buffering and processing
- DMA peripherals for efficient, low-latency data transfer between processor and FPGA
- Comprehensive connectivity: Ethernet MAC, USB 2.0 OTG, dual CANbus, SPI, I2C, UART/USART, MMC/SD/SDIO interfaces
- Industrial temperature grade: -40°C to 100°C (TJ) for extreme environment reliability
- Active production status with long-term availability commitment from AMD
- Compact 676-FCBGA package (27x27mm) for space-constrained designs
- RoHS compliant with full traceability and authentic AMD quality
Target Applications
The XC7Z030-2FF676I is engineered for demanding embedded applications across multiple industries:
- Industrial Automation: Motor control, machine vision, robotics, PLC systems, industrial IoT gateways
- Automotive: Advanced Driver Assistance Systems (ADAS), in-vehicle infotainment, sensor fusion, automotive Ethernet
- Aerospace & Defense: Avionics systems, radar processing, secure communications, flight control
- Medical Devices: Ultrasound imaging, patient monitoring, diagnostic equipment
- Communications: Software-defined radio (SDR), base station processing, protocol conversion
- Test & Measurement: High-speed data acquisition, signal analysis, automated test equipment
Why Choose the XC7Z030-2FF676I?
This SoC combines the best of both worlds: the software programmability of ARM processors with the hardware acceleration capabilities of FPGA logic. Design engineers can partition compute-intensive tasks to the FPGA fabric while running operating systems like Linux or real-time OS on the ARM cores. The result is lower power consumption, reduced latency, and higher system performance compared to traditional CPU+FPGA architectures.
AMD provides comprehensive development tools including Vivado Design Suite and Vitis unified software platform, along with extensive reference designs and IP cores to accelerate your time-to-market.
Documentation & Support
Full technical documentation available: Datasheets, reference manuals, application notes, reference designs, and development board schematics from AMD. RoHS compliant. Authentic AMD product with complete supply chain traceability and quality assurance.
Ordering Information
Part Number: XC7Z030-2FF676I
Availability: Active production, in stock
Package: 676-FCBGA (27x27mm)
Temperature Grade: Industrial (-40°C to 100°C)
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq®-7000 |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 800MHz |
| Primary Attributes | Kintex™-7 FPGA, 125K Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27x27) |

XC7Z030-2FF676I.pdf