AMD XC7Z035-1FBG676C
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 4,395.24 | Dhs. 4,395.24 |
| 15+ | Dhs. 4,256.44 | Dhs. 63,846.60 |
| 25+ | Dhs. 4,163.90 | Dhs. 104,097.50 |
| 50+ | Dhs. 3,932.58 | Dhs. 196,629.00 |
| 100+ | Dhs. 3,469.92 | Dhs. 346,992.00 |
| N+ | Dhs. 693.98 | Price Inquiry |
Request Quote / Inquiry
AMD Zynq-7000 XC7Z035-1FBG676C SoC FPGA
The XC7Z035-1FBG676C is a high-performance System-on-Chip (SoC) from AMD's Zynq®-7000 family, combining dual ARM® Cortex®-A9 MPCore™ processing system with Kintex™-7 FPGA programmable logic. This enterprise-grade component delivers 667MHz processing speed with 275K logic cells, making it ideal for aerospace, automotive, industrial automation, and telecom infrastructure applications.
Key Features
- Dual-core ARM Cortex-A9 MPCore with CoreSight – High-performance processing at 667MHz
- Kintex-7 FPGA fabric – 275,000 logic cells for flexible hardware acceleration
- 256KB on-chip RAM – Fast memory access for real-time applications
- Rich connectivity – CANbus, Ethernet, I2C, SPI, UART/USART, USB OTG, MMC/SD/SDIO
- Industrial temperature range – 0°C to 85°C (TJ) for demanding environments
- 676-FCBGA package – 27x27mm footprint for space-constrained designs
- RoHS compliant – Meets environmental standards for global deployment
Applications
This SoC is engineered for mission-critical systems requiring deterministic performance, long-term availability, and comprehensive documentation. Typical use cases include motor control, vision systems, software-defined radio, embedded computing platforms, and protocol bridging.
Documentation: Full datasheets, reference designs, and technical support available. Long-term supply commitment ensures design longevity.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq®-7000 |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 667MHz |
| Primary Attributes | Kintex™-7 FPGA, 275K Logic Cells |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27x27) |
| ROHS |  |
XC7Z035-1FBG676C.pdf