AMD XC7Z035-1FFG676I
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 1,498.42 | Dhs. 1,498.42 |
| 15+ | Dhs. 1,451.10 | Dhs. 21,766.50 |
| 25+ | Dhs. 1,419.55 | Dhs. 35,488.75 |
| 50+ | Dhs. 1,340.69 | Dhs. 67,034.50 |
| 100+ | Dhs. 1,182.96 | Dhs. 118,296.00 |
| N+ | Dhs. 236.59 | Price Inquiry |
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AMD Zynq-7000 SoC XC7Z035-1FFG676I - High-Performance Embedded Processing Platform
The AMD XC7Z035-1FFG676I is a powerful System-on-Chip (SoC) from the Zynq-7000 family, combining dual ARM Cortex-A9 MPCore processors with Kintex-7 FPGA fabric. This industrial-grade device delivers exceptional processing performance at 667MHz with 275K logic cells, making it ideal for aerospace, automotive, industrial automation, medical equipment, and telecommunications applications.
Key Features & Benefits
- Dual ARM Cortex-A9 MPCore with CoreSight: High-performance processing with advanced debugging capabilities
- Kintex-7 FPGA Integration: 275,000 logic cells for flexible hardware acceleration and custom logic implementation
- Rich Connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO interfaces
- Industrial Temperature Range: Operates reliably from -40°C to 100°C (TJ)
- 256KB On-Chip RAM: Fast memory for critical real-time operations
- DMA Support: Efficient data transfer with minimal CPU overhead
- RoHS Compliant: Meets environmental and safety standards
Applications
This versatile SoC is engineered for demanding embedded applications requiring both processing power and programmable logic, including motor control systems, vision processing, software-defined radio, industrial IoT gateways, medical imaging equipment, and advanced driver assistance systems (ADAS).
Quality Assurance: All components are sourced from authorized distributors with full traceability and compliance documentation. We provide datasheets, reference designs, and technical support to ensure successful design-in for your engineering projects.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq®-7000 |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 667MHz |
| Primary Attributes | Kintex™-7 FPGA, 275K Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27x27) |
| ROHS |  |
XC7Z035-1FFG676I.pdf