AMD XC7Z035-1FFG900C

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AMD Zynq-7000 SoC XC7Z035-1FFG900C - Professional-Grade Embedded Processing

The XC7Z035-1FFG900C represents the pinnacle of AMD's Zynq-7000 SoC family, delivering exceptional performance for mission-critical applications in aerospace, automotive, industrial automation, and telecommunications infrastructure. This advanced System-on-Chip seamlessly integrates dual ARM Cortex-A9 MPCore processors with Kintex-7 FPGA fabric, providing unmatched flexibility for custom hardware acceleration and real-time processing.

Engineered for demanding embedded applications, this SoC combines 667MHz dual-core processing power with 275,000 logic cells of programmable FPGA fabric, enabling you to implement custom signal processing, protocol handling, and hardware acceleration alongside your software stack. The integrated 256KB RAM and comprehensive DMA peripherals ensure efficient data movement for high-throughput applications.

Why Choose the XC7Z035-1FFG900C?

  • Dual ARM Cortex-A9 MPCore: 667MHz processing with CoreSight debug technology for advanced development and diagnostics
  • Kintex-7 FPGA Fabric: 275,000 logic cells provide extensive programmable logic for custom IP and hardware acceleration
  • Industrial-Grade Reliability: Operating temperature range 0°C to 85°C (TJ) ensures stable performance in harsh environments
  • Comprehensive Connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO for versatile system integration
  • Compact 900-FCBGA Package: 31x31mm footprint optimizes board space without compromising performance
  • Active Production Status: Long-term availability and RoHS compliance for sustainable product lifecycles
  • 256KB Integrated RAM: On-chip memory reduces latency for time-critical operations
  • DMA Peripherals: Efficient data transfer without CPU intervention maximizes system throughput

Ideal Applications

This SoC excels in applications requiring both processing power and FPGA flexibility: industrial motor control and automation, automotive ADAS and infotainment systems, aerospace avionics and instrumentation, medical imaging and diagnostic equipment, telecommunications base stations and network infrastructure, video processing and machine vision systems, and high-speed data acquisition platforms.

Documentation & Support

Full technical documentation, reference designs, and development tools are available from AMD. This component is backed by comprehensive datasheets, application notes, and a robust ecosystem of development boards and software tools to accelerate your time-to-market.

Product attributes Property Value
Manufacturer AMD
Product Series Zynq®-7000
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 667MHz
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells
Operating Temperature 0°C ~ 85°C (TJ)
Grade -
Qualification -
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY