AMD XC7Z035-2FBG676I

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AMD Zynq-7000 SoC: XC7Z035-2FBG676I

The XC7Z035-2FBG676I is a high-performance System-on-Chip (SoC) from AMD's Zynq-7000 family, combining dual ARM Cortex-A9 MPCore processors with Kintex-7 FPGA fabric. Engineered for mission-critical industrial, automotive, aerospace, and communications applications requiring robust processing power and programmable logic in a single, integrated device.

Key Features & Benefits

  • Dual ARM Cortex-A9 MPCore with CoreSight running at 800MHz delivers deterministic real-time processing for time-critical control loops and embedded applications
  • Kintex-7 FPGA fabric with 275,000 logic cells provides flexible hardware acceleration, custom I/O interfaces, and parallel processing capabilities
  • 256KB on-chip RAM enables fast data access and reduces latency for high-speed control algorithms
  • Comprehensive connectivity suite: CANbus for automotive/industrial networks, Gigabit Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO for versatile system integration
  • Industrial temperature range: -40°C to 100°C (TJ) ensures reliable operation in harsh environments
  • Compact 676-FCBGA package (27x27mm) optimizes board space for high-density embedded designs
  • Active part status with AMD's long-term availability commitment for production stability
  • RoHS compliant meeting environmental and regulatory requirements for global markets

Target Applications

The XC7Z035-2FBG676I excels in demanding embedded systems including:

  • Embedded vision & image processing: Real-time video analytics, machine vision inspection, medical imaging
  • Industrial automation & control: Motion control, PLC replacement, robotics, factory automation
  • Automotive systems: ADAS, infotainment, gateway controllers, powertrain management
  • Aerospace & defense: Avionics, radar processing, secure communications, instrumentation
  • Software-defined radio (SDR): Wireless base stations, spectrum monitoring, signal intelligence
  • Edge computing platforms: AI inference acceleration, IoT gateways, distributed processing nodes

Why Choose XC7Z035-2FBG676I?

This SoC delivers the optimal balance of programmable logic and processing system performance. The tight integration between ARM processors and FPGA fabric enables low-latency communication, deterministic response times, and power-efficient acceleration of compute-intensive tasks—all critical for next-generation embedded systems.

Documentation & Support

Full datasheets, reference designs, development tools, and technical documentation are available from AMD. Our team provides expert technical support to help you integrate this SoC into your design with confidence.

Product attributes Property Value
Manufacturer AMD
Product Series Zynq®-7000
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY