AMD XC7Z035-3FBG676E

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Normaler Preis Dhs. 7,002.14
Normaler Preis Dhs. 7,370.66 Verkaufspreis Dhs. 7,002.14
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15+ Dhs. 6,781.01 Dhs. 101,715.15
25+ Dhs. 6,633.59 Dhs. 165,839.75
50+ Dhs. 6,265.06 Dhs. 313,253.00
100+ Dhs. 5,528.00 Dhs. 552,800.00
N+ Dhs. 1,105.60 Price Inquiry
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AMD Zynq-7000 SoC: XC7Z035-3FBG676E

The XC7Z035-3FBG676E is a high-performance System-on-Chip (SoC) from AMD's Zynq-7000 family, combining the processing power of a Dual ARM Cortex-A9 MPCore with CoreSight running at 1GHz with the flexibility of a Kintex-7 FPGA featuring 275K logic cells. This powerful combination delivers exceptional performance for mission-critical applications in aerospace, automotive, industrial automation, medical devices, and telecommunications.

Key Features & Benefits

  • Dual-core ARM Cortex-A9 MPCore processor at 1GHz for high-performance embedded processing
  • Kintex-7 FPGA with 275K logic cells for customizable hardware acceleration and I/O flexibility
  • 256KB on-chip RAM for fast data access and processing
  • Rich connectivity options: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO, EBI/EMI
  • DMA peripherals for efficient data transfer
  • Industrial temperature range: 0°C to 100°C (TJ) for reliable operation in demanding environments
  • 676-FCBGA package (27x27mm) for space-efficient PCB design
  • RoHS compliant for environmental compliance
  • Active part status with long lifecycle support for critical designs

Ideal Applications

This SoC is engineered for applications requiring both high-performance processing and FPGA programmability, including industrial control systems, motor drives, vision systems, software-defined radio, aerospace avionics, automotive ADAS, medical imaging equipment, and high-speed data acquisition systems.

Why Choose This Component?

As an authorized distributor, we provide full traceability, RoHS/REACH compliance documentation, and long lifecycle availability to support your critical designs. This component is backed by comprehensive technical support and reliable supply chain management for aerospace, automotive, industrial, medical, and telecommunications applications.

Product attributes Property Value
Manufacturer AMD
Product Series Zynq®-7000
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1GHz
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY