AMD XC7Z035-3FBG676E
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 7,002.14 | Dhs. 7,002.14 |
| 15+ | Dhs. 6,781.01 | Dhs. 101,715.15 |
| 25+ | Dhs. 6,633.59 | Dhs. 165,839.75 |
| 50+ | Dhs. 6,265.06 | Dhs. 313,253.00 |
| 100+ | Dhs. 5,528.00 | Dhs. 552,800.00 |
| N+ | Dhs. 1,105.60 | Price Inquiry |
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AMD Zynq-7000 SoC: XC7Z035-3FBG676E
The XC7Z035-3FBG676E is a high-performance System-on-Chip (SoC) from AMD's Zynq-7000 family, combining the processing power of a Dual ARM Cortex-A9 MPCore with CoreSight running at 1GHz with the flexibility of a Kintex-7 FPGA featuring 275K logic cells. This powerful combination delivers exceptional performance for mission-critical applications in aerospace, automotive, industrial automation, medical devices, and telecommunications.
Key Features & Benefits
- Dual-core ARM Cortex-A9 MPCore processor at 1GHz for high-performance embedded processing
- Kintex-7 FPGA with 275K logic cells for customizable hardware acceleration and I/O flexibility
- 256KB on-chip RAM for fast data access and processing
- Rich connectivity options: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO, EBI/EMI
- DMA peripherals for efficient data transfer
- Industrial temperature range: 0°C to 100°C (TJ) for reliable operation in demanding environments
- 676-FCBGA package (27x27mm) for space-efficient PCB design
- RoHS compliant for environmental compliance
- Active part status with long lifecycle support for critical designs
Ideal Applications
This SoC is engineered for applications requiring both high-performance processing and FPGA programmability, including industrial control systems, motor drives, vision systems, software-defined radio, aerospace avionics, automotive ADAS, medical imaging equipment, and high-speed data acquisition systems.
Why Choose This Component?
As an authorized distributor, we provide full traceability, RoHS/REACH compliance documentation, and long lifecycle availability to support your critical designs. This component is backed by comprehensive technical support and reliable supply chain management for aerospace, automotive, industrial, medical, and telecommunications applications.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq®-7000 |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 1GHz |
| Primary Attributes | Kintex™-7 FPGA, 275K Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27x27) |
| ROHS |

XC7Z035-3FBG676E.pdf