AMD XC7Z035-3FFG676E

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Normaler Preis Dhs. 8,750.07
Normaler Preis Dhs. 9,210.61 Verkaufspreis Dhs. 8,750.07
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AMD Zynq-7000 SoC: XC7Z035-3FFG676E

The XC7Z035-3FFG676E is a high-performance System-on-Chip (SoC) from AMD's Zynq-7000 family, combining the processing power of a dual ARM® Cortex®-A9 MPCore™ processor running at 1GHz with the flexibility of a Kintex™-7 FPGA featuring 275K logic cells. This powerful combination delivers exceptional performance for embedded applications requiring both software programmability and hardware acceleration.

Key Features & Benefits

  • Dual-Core Processing: ARM Cortex-A9 MPCore with CoreSight for advanced debugging and trace capabilities
  • High-Performance FPGA: Kintex-7 architecture with 275,000 logic cells for custom hardware acceleration
  • Rich Connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO interfaces
  • Industrial Temperature Range: 0°C to 100°C (TJ) for reliable operation in demanding environments
  • Compact Package: 676-FCBGA (27x27mm) for space-constrained designs

Ideal Applications

Perfect for industrial automation, automotive systems, medical imaging, video processing, software-defined radio, and advanced embedded systems requiring both processing power and FPGA flexibility.

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Product attributes Property Value
Manufacturer AMD
Product Series Zynq®-7000
Packaging Tray | Tray
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1GHz
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)