AMD XC7Z035-L2FBG676I

Zu Produktinformationen springen
1 von 1
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Normaler Preis Dhs. 7,002.14
Normaler Preis Dhs. 7,370.66 Verkaufspreis Dhs. 7,002.14
Sale Ausverkauft
Quantity Unit Price Total Price
1 Dhs. 7,002.14 Dhs. 7,002.14
15+ Dhs. 6,781.01 Dhs. 101,715.15
25+ Dhs. 6,633.59 Dhs. 165,839.75
50+ Dhs. 6,265.06 Dhs. 313,253.00
100+ Dhs. 5,528.00 Dhs. 552,800.00
N+ Dhs. 1,105.60 Price Inquiry
Versand wird beim Checkout berechnet
Anzahl
Component Recycling

Request Quote / Inquiry

AMD Zynq-7000 SoC FPGA - XC7Z035-L2FBG676I

The XC7Z035-L2FBG676I is a high-performance System-on-Chip (SoC) from AMD's Zynq-7000 family, combining dual ARM Cortex-A9 MPCore processors with Kintex-7 FPGA fabric. This industrial-grade device delivers exceptional processing power at 800MHz with 275K logic cells, making it ideal for mission-critical applications in aerospace, automotive, industrial automation, medical devices, and telecommunications.

Key Features & Benefits

  • Dual-Core Processing: ARM Cortex-A9 MPCore with CoreSight debug technology running at 800MHz
  • Programmable Logic: Kintex-7 FPGA architecture with 275,000 logic cells for custom hardware acceleration
  • Rich Connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO interfaces
  • Industrial Temperature Range: Qualified for -40°C to +100°C (TJ) operation
  • Compact Package: 676-pin FCBGA (27x27mm) for space-constrained designs
  • RoHS Compliant: Meets environmental standards for global deployment

Target Applications

This SoC excels in applications requiring real-time processing, hardware acceleration, and flexible I/O: embedded vision systems, motor control, software-defined radio, industrial networking, medical imaging, and aerospace/defense systems.

Authorized Distributor: We provide 100% authentic AMD components with full traceability, manufacturer warranty support, and technical documentation. All parts are sourced through authorized channels and comply with RoHS/REACH regulations.

Product attributes Property Value
Manufacturer AMD
Product Series Zynq®-7000
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY