AMD XC7Z045-1FBG676C
Normaler Preis
Dhs. 5,124.60
Normaler Preis
Dhs. 5,394.31
Verkaufspreis
Dhs. 5,124.60
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 5,124.60 | Dhs. 5,124.60 |
| 15+ | Dhs. 4,962.77 | Dhs. 74,441.55 |
| 25+ | Dhs. 4,854.88 | Dhs. 121,372.00 |
| 50+ | Dhs. 4,585.16 | Dhs. 229,258.00 |
| 100+ | Dhs. 4,045.73 | Dhs. 404,573.00 |
| N+ | Dhs. 809.15 | Price Inquiry |
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AMD Zynq-7000 SoC: XC7Z045-1FBG676C
The XC7Z045-1FBG676C is a high-performance System-on-Chip (SoC) from AMD's Zynq-7000 family, combining the software programmability of a Dual ARM Cortex-A9 MPCore processor with the hardware flexibility of Kintex-7 FPGA fabric. This powerful integration delivers 667MHz processing speed with 350K logic cells, making it ideal for mission-critical applications in aerospace, automotive, industrial automation, medical devices, and telecommunications.
Key Features & Benefits
- Dual ARM Cortex-A9 MPCore with CoreSight: High-performance processing at 667MHz for demanding embedded applications
- Kintex-7 FPGA with 350K Logic Cells: Extensive programmable logic for custom hardware acceleration and signal processing
- 256KB On-Chip RAM: Fast memory access for real-time processing requirements
- Rich Connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO interfaces for versatile system integration
- Industrial Temperature Range: 0°C to 85°C (TJ) operation for reliable performance in harsh environments
- RoHS Compliant: Meets environmental standards for global deployment
- 676-FCBGA Package: Compact 27x27mm footprint for space-constrained designs
Applications
This SoC is engineered for high-reliability systems requiring both processing power and FPGA flexibility: embedded vision systems, motor control, industrial networking, software-defined radio, medical imaging, avionics, and automotive ADAS platforms.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq®-7000 |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 667MHz |
| Primary Attributes | Kintex™-7 FPGA, 350K Logic Cells |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27x27) |
| ROHS |  |
XC7Z045-1FBG676C.pdf
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