AMD XC7Z045-1FBG676CES

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Normaler Preis Dhs. 3,638.28
Normaler Preis Dhs. 3,829.78 Verkaufspreis Dhs. 3,638.28
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1 Dhs. 3,638.28 Dhs. 3,638.28
15+ Dhs. 3,523.40 Dhs. 52,851.00
25+ Dhs. 3,446.80 Dhs. 86,170.00
50+ Dhs. 3,255.31 Dhs. 162,765.50
100+ Dhs. 2,872.34 Dhs. 287,234.00
N+ Dhs. 574.47 Price Inquiry
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AMD Zynq-7000 SoC: XC7Z045-1FBG676CES

The XC7Z045-1FBG676CES is a high-performance System-on-Chip (SoC) from AMD's Zynq-7000 family, combining dual ARM Cortex-A9 MPCore processors with Kintex-7 FPGA fabric. This powerful integration delivers 667MHz processing speed with 350K logic cells, making it ideal for mission-critical applications in aerospace, industrial automation, medical devices, and telecommunications.

Key Features & Benefits

  • Dual-Core Processing: ARM Cortex-A9 MPCore with CoreSight for advanced debugging and trace capabilities
  • Kintex-7 FPGA Fabric: 350,000 logic cells for custom hardware acceleration and parallel processing
  • Rich Connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO interfaces
  • Industrial Temperature Range: 0°C to 85°C (TJ) for reliable operation in demanding environments
  • Compact 676-FCBGA Package: 27x27mm footprint optimized for space-constrained designs

Applications: Aerospace systems, automotive ADAS, industrial control & automation, medical imaging equipment, telecommunications infrastructure, defense & military systems.

Note: This part is marked as obsolete. Please contact us for availability, lifecycle support, and recommended alternatives for new designs.

Product attributes Property Value
Manufacturer AMD
Product Series Zynq®-7000
Packaging Tray |
Part Status Obsolete
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 667MHz
Primary Attributes Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature 0°C ~ 85°C (TJ)
Grade -
Qualification -
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)