AMD XCSU200P-1FSVG1156I
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 2,059.70 | Dhs. 2,059.70 |
| 15+ | Dhs. 1,994.67 | Dhs. 29,920.05 |
| 25+ | Dhs. 1,951.31 | Dhs. 48,782.75 |
| 50+ | Dhs. 1,842.90 | Dhs. 92,145.00 |
| 100+ | Dhs. 1,626.09 | Dhs. 162,609.00 |
| N+ | Dhs. 325.22 | Price Inquiry |
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| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Spartan® UltraScale+™ |
| Packaging | Tray |
| Number of LABs/CLBs | - |
| Number of Logic Elements/Cells | 218400 |
| Total RAM Bits | 7130317 |
| Number of I/O | 572 |
| Voltage - Supply | 0.825V ~ 0.876V |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Memory Type | Surface Mount |
| Grade | - |
| Qualification | - |
| Package / Case | 1156-BGA, FCBGA |
| Supplier Device Package | 1156-FCBGA (35x35) |
| ROHS |  |
AMD Spartan® UltraScale+™ FPGA - XCSU200P-1FSVG1156I
The XCSU200P-1FSVG1156I is a high-performance FPGA from AMD's Spartan® UltraScale+™ family, designed for demanding embedded applications requiring substantial logic resources and I/O flexibility. This industrial-grade device delivers exceptional performance with 218,400 logic elements and 572 I/O pins in a compact 1156-FCBGA package.
Key Features & Benefits
- High Logic Density: 218,400 logic elements/cells for complex digital designs
- Extensive Memory: 7,130,317 total RAM bits for data-intensive applications
- Flexible I/O: 572 I/O pins supporting multiple interface standards
- Industrial Temperature Range: Operates reliably from -40°C to 100°C (TJ)
- Optimized Power: 0.825V ~ 0.876V supply voltage for efficient operation
- Compact Footprint: 35x35mm 1156-FCBGA package ideal for space-constrained designs
Ideal Applications
Perfect for industrial automation, embedded vision systems, motor control, communications infrastructure, test & measurement equipment, and aerospace/defense applications requiring high reliability and performance.
RoHS Compliant - Environmentally friendly and meets international standards.
Why Choose This FPGA?
AMD's Spartan UltraScale+ architecture combines proven 16nm FinFET technology with advanced features, delivering the optimal balance of performance, power efficiency, and cost-effectiveness for your next-generation embedded design.
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
