AMD XCSU25P-2SBVB625E
Normaler Preis
$56.19
Normaler Preis
$59.15
Verkaufspreis
$56.19
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | $56.19 | $56.19 |
| 15+ | $54.42 | $816.30 |
| 25+ | $53.24 | $1,331.00 |
| 50+ | $50.28 | $2,514.00 |
| 100+ | $44.36 | $4,436.00 |
| N+ | $8.87 | Price Inquiry |
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| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Spartan® UltraScale+™ |
| Packaging | Tray |
| Number of LABs/CLBs | - |
| Number of Logic Elements/Cells | 21875 |
| Total RAM Bits | 1782579 |
| Number of I/O | 304 |
| Voltage - Supply | 0.825V ~ 0.876V |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Memory Type | Surface Mount |
| Grade | - |
| Qualification | - |
| Package / Case | 625-BGA, FCBGA |
| Supplier Device Package | 625-FCBGA (21x21) |
| ROHS |  |
AMD Spartan® UltraScale+™ FPGA - XCSU25P-2SBVB625E
The XCSU25P-2SBVB625E is a high-performance field-programmable gate array (FPGA) from AMD's Spartan® UltraScale+™ family, designed for embedded applications requiring flexible logic, high I/O density, and industrial-grade reliability.
Key Features:
- 21,875 Logic Elements - Ample programmable logic for complex digital designs
- 304 I/O Pins - Extensive connectivity for interfacing with multiple peripherals
- 1.78 Mb Total RAM - Integrated block RAM for data buffering and storage
- Industrial Temperature Range - Operates reliably from 0°C to 100°C (TJ)
- Compact 625-FCBGA Package - Space-efficient 21x21mm footprint for dense PCB layouts
- Low Power Supply - 0.825V to 0.876V core voltage for energy-efficient operation
Applications:
Ideal for industrial automation, embedded vision systems, motor control, communications infrastructure, and high-speed data acquisition systems requiring programmable logic with robust I/O capabilities.
Technical Specifications:
Authenticity Guaranteed: All components are sourced directly from authorized distributors and come with full traceability documentation.
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
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